Gowrisankar Damarla

Person

Boise, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Stair step structures including insulative materials, and related d...
- Patent number 11,088,017
- Issue date Aug 10, 2021
- Micron Technology, Inc.
- John B. Matovu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect assemblies with through-silicon vias and stress-relief...
- Patent number 10,847,442
- Issue date Nov 24, 2020
- Micron Technology, Inc.
- Hongqi Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including a stair step structure, and related...
- Patent number 10,600,682
- Issue date Mar 24, 2020
- Micron Technology, Inc.
- John B. Matovu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid state memory component
- Patent number 10,318,170
- Issue date Jun 11, 2019
- Intel Corporation
- Jun Zhao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Capping poly channel pillars in stacked circuits
- Patent number 10,319,678
- Issue date Jun 11, 2019
- Intel Corporation
- Hongqi Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming semiconductor structures having stair step struc...
- Patent number 10,269,625
- Issue date Apr 23, 2019
- Micron Technology, Inc.
- John B. Matovu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional memory device having isolated periphery contacts...
- Patent number 10,096,612
- Issue date Oct 9, 2018
- Intel Corporation
- Sri Sai Sivakumar Vegunta
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor constructions and methods of forming intersecting lin...
- Patent number 9,911,643
- Issue date Mar 6, 2018
- Micron Technology, Inc.
- Hongqi Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid state memory component
- Patent number 9,857,989
- Issue date Jan 2, 2018
- Intel Corporation
- Jun Zhao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for forming a metal cap in a semiconductor memory device
- Patent number 9,577,192
- Issue date Feb 21, 2017
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Muralikrishnan Balakrishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor constructions
- Patent number 9,391,001
- Issue date Jul 12, 2016
- Micron Technology, Inc.
- Hongqi Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capping poly channel pillars in stacked circuits
- Patent number 9,263,459
- Issue date Feb 16, 2016
- Intel Corporation
- Hongqi Li
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HIGH QUALITY INSITU TREATED PECVD FILM
- Publication number 20240234130
- Publication date Jul 11, 2024
- TEXAS INSTRUMENTS INCORPORATED
- SK Saiful Islam
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
STAIR STEP STRUCTURES INCLUDING INSULATIVE MATERIALS, AND RELATED D...
- Publication number 20200203220
- Publication date Jun 25, 2020
- Micron Technology, Inc.
- John B. Matovu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID STATE MEMORY COMPONENT
- Publication number 20190294330
- Publication date Sep 26, 2019
- Intel Corporation
- Jun Zhao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING A STAIR STEP STRUCTURE, AND RELATED...
- Publication number 20190206727
- Publication date Jul 4, 2019
- Micron Technology, Inc.
- John B. Matovu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE DIMENSIONAL MEMORY DEVICE HAVING ISOLATED PERIPHERY CONTACTS...
- Publication number 20190051662
- Publication date Feb 14, 2019
- Intel Corporation
- Sri Sai Sivakumar VEGUNTA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SOLID STATE MEMORY COMPONENT
- Publication number 20180307412
- Publication date Oct 25, 2018
- Intel Corporation
- Jun Zhao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD FOR FORMING A METAL CAP IN A SEMICONDUCTOR MEMORY DEVICE
- Publication number 20170133585
- Publication date May 11, 2017
- Sony Semiconductor Solutions Corporation
- Muralikrishnan Balakrishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE DIMENSIONAL MEMORY DEVICE HAVING ISOLATED PERIPHERY CONTACTS...
- Publication number 20170077117
- Publication date Mar 16, 2017
- SRI SAI SIVAKUMAR VEGUNTA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Semiconductor Constructions and Methods of Forming Intersecting Lin...
- Publication number 20160293482
- Publication date Oct 6, 2016
- Micron Technology, Inc.
- Hongqi Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPPING POLY CHANNEL PILLARS IN STACKED CIRCUITS
- Publication number 20160247756
- Publication date Aug 25, 2016
- Intel Corporation
- Hongqi Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A METAL CAP IN A SEMICONDUCTOR MEMORY DEVICE
- Publication number 20150340247
- Publication date Nov 26, 2015
- SONY CORPORATION
- Muralikrishnan Balakrishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT ASSEMBLIES WITH THROUGH-SILICON VIAS AND STRESS-RELIEF...
- Publication number 20150243583
- Publication date Aug 27, 2015
- Micron Technology, Inc.
- Hongqi Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Constructions
- Publication number 20150054164
- Publication date Feb 26, 2015
- Micron Technology, Inc.
- Hongqi Li
- H01 - BASIC ELECTRIC ELEMENTS

Gowrisankar Damarla

Person

Patents Grantslast 30 patents

Stair step structures including insulative materials, and related d...

Interconnect assemblies with through-silicon vias and stress-relief...

Semiconductor devices including a stair step structure, and related...

Solid state memory component

Capping poly channel pillars in stacked circuits

Methods of forming semiconductor structures having stair step struc...

Three dimensional memory device having isolated periphery contacts...

Semiconductor constructions and methods of forming intersecting lin...

Solid state memory component

Method for forming a metal cap in a semiconductor memory device

Semiconductor constructions

Capping poly channel pillars in stacked circuits

Patents Applicationslast 30 patents

HIGH QUALITY INSITU TREATED PECVD FILM

STAIR STEP STRUCTURES INCLUDING INSULATIVE MATERIALS, AND RELATED D...

SOLID STATE MEMORY COMPONENT

SEMICONDUCTOR DEVICES INCLUDING A STAIR STEP STRUCTURE, AND RELATED...

THREE DIMENSIONAL MEMORY DEVICE HAVING ISOLATED PERIPHERY CONTACTS...

SOLID STATE MEMORY COMPONENT

METHOD FOR FORMING A METAL CAP IN A SEMICONDUCTOR MEMORY DEVICE

THREE DIMENSIONAL MEMORY DEVICE HAVING ISOLATED PERIPHERY CONTACTS...

Semiconductor Constructions and Methods of Forming Intersecting Lin...

CAPPING POLY CHANNEL PILLARS IN STACKED CIRCUITS

METHOD FOR FORMING A METAL CAP IN A SEMICONDUCTOR MEMORY DEVICE

INTERCONNECT ASSEMBLIES WITH THROUGH-SILICON VIAS AND STRESS-RELIEF...

Semiconductor Constructions