Greg L. Allen

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Boise, ID, US

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Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit package employing flip-chip technology and metho...
- Patent number 7,002,254
- Issue date Feb 21, 2006
- Hewlett-Packard Development Company, L.P.
- Timothy V. Harper
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit package employing flip-chip technology and metho...
- Patent number 6,659,512
- Issue date Dec 9, 2003
- Hewlett-Packard Development Company, L.P.
- Timothy V. Harper
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Integrated-circuit die having redundant signal pads and related int...
- Publication number 20060267221
- Publication date Nov 30, 2006
- Greg Lee Allen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit package employing flip-chip technology and metho...
- Publication number 20040046263
- Publication date Mar 11, 2004
- Timothy V. Harper
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Integrated circuit package employing flip-chip technology and metho...
- Publication number 20040036152
- Publication date Feb 26, 2004
- Timothy V. Harper
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flip-chip integrated circuit package and method of assembly
- Publication number 20040012094
- Publication date Jan 22, 2004
- Timothy V. Harper
- H01 - BASIC ELECTRIC ELEMENTS