Gregg A. Knotts

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Rochester, MN, US

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Patents Grantslast 30 patents

Information Patent Grant
Direct chip attachment process and apparatus for aluminum wirebondi...
- Patent number 5,632,438
- Issue date May 27, 1997
- International Business Machines Corporation
- Mark K. Hoffmeyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder ball connect pad-on-via assembly process
- Patent number 5,275,330
- Issue date Jan 4, 1994
- International Business Machines Corp.
- Phillip D. Isaacs
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR