Gregor Feiertag

Person

Muenchen, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Multi-MEMS module
- Patent number 10,015,600
- Issue date Jul 3, 2018
- TDK Corporation
- Wolfgang Pahl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor module and method for producing sensor modules
- Patent number 9,061,888
- Issue date Jun 23, 2015
- EPCOS AG
- Wolfgang Pahl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Miniaturized electrical component comprising an MEMS and an ASIC an...
- Patent number 9,056,760
- Issue date Jun 16, 2015
- EPCOS AG
- Gregor Feiertag
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for encapsulating an MEMS component
- Patent number 9,051,174
- Issue date Jun 9, 2015
- EPCOS AG
- Wolfgang Pahl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS microphone and method for producing the MEMS microphone
- Patent number 8,865,499
- Issue date Oct 21, 2014
- EPCOS AG
- Wolfgang Pahl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS package and method for the production thereof
- Patent number 8,674,498
- Issue date Mar 18, 2014
- EPCOS AG
- Gregor Feiertag
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS component, method for producing a MEMS component, and method f...
- Patent number 8,674,464
- Issue date Mar 18, 2014
- EPCOS AG
- Wolfgang Pahl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor chip arrangement with sensor chip and manufacturing m...
- Patent number 8,580,613
- Issue date Nov 12, 2013
- EPCOS AG
- Gregor Feiertag
- G01 - MEASURING TESTING
Information Patent Grant
MEMS microphone
- Patent number 8,571,239
- Issue date Oct 29, 2013
- EPCOS AG
- Gregor Feiertag
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Arrangement comprising a microphone
- Patent number 8,553,920
- Issue date Oct 8, 2013
- EPCOS AG
- Gregor Feiertag
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for producing a MEMS package
- Patent number 8,404,516
- Issue date Mar 26, 2013
- EPCOS AG
- Christian Bauer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electrical component and production method
- Patent number 8,294,535
- Issue date Oct 23, 2012
- EPCOS AG
- Gregor Feiertag
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Method for hermetically encapsulating a component
- Patent number 7,552,532
- Issue date Jun 30, 2009
- EPCOS AG
- Alois Stelzl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for encapsulating an electrical component, and surface acous...
- Patent number 7,518,201
- Issue date Apr 14, 2009
- EPCOS AG
- Alois Stelzl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated electronic component and production method
- Patent number 7,388,281
- Issue date Jun 17, 2008
- EPCOS AG
- Hans Krueger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for encapsulating an electrical component
- Patent number 7,094,626
- Issue date Aug 22, 2006
- EPCOS AG
- Alois Stelzl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate for an electric component and method for the production t...
- Patent number 6,909,183
- Issue date Jun 21, 2005
- EPCOS AG
- Gregor Feiertag
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
MULTI-MEMS MODULE
- Publication number 20160345106
- Publication date Nov 24, 2016
- EPCOS AG
- Wolfgang Pahl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS Microphone And Method For Producing The MEMS Microphone
- Publication number 20130140656
- Publication date Jun 6, 2013
- EPCOS AG
- Wolfgang Pahl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Miniaturized Electrical Component Comprising an MEMS and an ASIC an...
- Publication number 20130119492
- Publication date May 16, 2013
- EPCOS AG
- Gregor Feiertag
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS MICROPHONE
- Publication number 20120093346
- Publication date Apr 19, 2012
- EPCOS AG
- Gregor Feiertag
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SENSOR MODULE AND METHOD FOR PRODUCING SENSOR MODULES
- Publication number 20110298064
- Publication date Dec 8, 2011
- EPCOS AG
- Wolfgang Pahl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR CHIP ARRANGEMENT WITH SENSOR CHIP AND MANUFACTURING M...
- Publication number 20110233690
- Publication date Sep 29, 2011
- EPCOS AG
- Gregor Feiertag
- G01 - MEASURING TESTING
Information Patent Application
METHOD FOR ENCAPSULATING AN MEMS COMPONENT
- Publication number 20110180885
- Publication date Jul 28, 2011
- EPCOS AG
- Wolfgang Pahl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS Component, Method for Producing a MEMS Component, and Method f...
- Publication number 20110018076
- Publication date Jan 27, 2011
- Wolfgang Pahl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS PACKAGE AND METHOD FOR THE PRODUCTION THEREOF
- Publication number 20110006381
- Publication date Jan 13, 2011
- EPCOS AG
- Gregor Feiertag
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Arrangement Comprising a Microphone
- Publication number 20100272302
- Publication date Oct 28, 2010
- Gregor Feiertag
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method for Producing a MEMS Package
- Publication number 20100127377
- Publication date May 27, 2010
- Christian Bauer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Electrical component and production method
- Publication number 20090224851
- Publication date Sep 10, 2009
- EPCOS AG
- Gregor Feiertag
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Method for encapsulating an electrical component, and surface acous...
- Publication number 20060249802
- Publication date Nov 9, 2006
- EPCOS AG
- Alois Stelzl
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Encapsulated electronic component and production method
- Publication number 20060151203
- Publication date Jul 13, 2006
- Hans Krueger
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Method for encapsulating an electrical component and surface wave c...
- Publication number 20040239449
- Publication date Dec 2, 2004
- Alois Stelzl
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Method for hermetically encapsulating a component
- Publication number 20040237299
- Publication date Dec 2, 2004
- Alois Stelzl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate for an electric component and method for the production t...
- Publication number 20040058473
- Publication date Mar 25, 2004
- Gregor Feiertag
- H03 - BASIC ELECTRONIC CIRCUITRY

Gregor Feiertag

Person

Patents Grantslast 30 patents

Multi-MEMS module

Sensor module and method for producing sensor modules

Miniaturized electrical component comprising an MEMS and an ASIC an...

Method for encapsulating an MEMS component

MEMS microphone and method for producing the MEMS microphone

MEMS package and method for the production thereof

MEMS component, method for producing a MEMS component, and method f...

Semiconductor chip arrangement with sensor chip and manufacturing m...

MEMS microphone

Arrangement comprising a microphone

Method for producing a MEMS package

Electrical component and production method

Method for hermetically encapsulating a component

Method for encapsulating an electrical component, and surface acous...

Encapsulated electronic component and production method

Method for encapsulating an electrical component

Substrate for an electric component and method for the production t...

Patents Applicationslast 30 patents

MULTI-MEMS MODULE

MEMS Microphone And Method For Producing The MEMS Microphone

Miniaturized Electrical Component Comprising an MEMS and an ASIC an...

MEMS MICROPHONE

SENSOR MODULE AND METHOD FOR PRODUCING SENSOR MODULES

SEMICONDUCTOR CHIP ARRANGEMENT WITH SENSOR CHIP AND MANUFACTURING M...

METHOD FOR ENCAPSULATING AN MEMS COMPONENT

MEMS Component, Method for Producing a MEMS Component, and Method f...

MEMS PACKAGE AND METHOD FOR THE PRODUCTION THEREOF

Arrangement Comprising a Microphone

Method for Producing a MEMS Package

Electrical component and production method

Method for encapsulating an electrical component, and surface acous...

Encapsulated electronic component and production method

Method for encapsulating an electrical component and surface wave c...

Method for hermetically encapsulating a component

Substrate for an electric component and method for the production t...