Gregory A. Carlson

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Goleta, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Wafer level packaging of microbolometer vacuum package assemblies
- Patent number 10,553,454
- Issue date Feb 4, 2020
- FLIR Systems, Inc.
- Paul Schweikert
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer level packaging of infrared camera detectors
- Patent number 10,161,803
- Issue date Dec 25, 2018
- FLIR Systems, Inc.
- Gregory A. Carlson
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Wafer level packaging of reduced-height infrared detectors
- Patent number 10,153,204
- Issue date Dec 11, 2018
- FLIR Systems, Inc.
- Tiahaar Kurtheru Clayton McKenzie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level packaging of microbolometer vacuum package assemblies
- Patent number 9,741,591
- Issue date Aug 22, 2017
- FLIR Systems, Inc.
- Paul Schweikert
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer level packaging of infrared camera detectors
- Patent number 9,513,172
- Issue date Dec 6, 2016
- FLIR Systems, Inc.
- Gregory A. Carlson
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
WAFER LEVEL PACKAGING OF MICROBOLOMETER VACUUM PACKAGE ASSEMBLIES
- Publication number 20170372920
- Publication date Dec 28, 2017
- FLIR SYSTEMS, INC.
- Paul Schweikert
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WAFER LEVEL PACKAGING OF INFRARED CAMERA DETECTORS
- Publication number 20170328779
- Publication date Nov 16, 2017
- FLIR SYSTEMS, INC.
- Gregory A. Carlson
- G01 - MEASURING TESTING
Information Patent Application
WAFER LEVEL PACKAGING OF INFRARED CAMERA DETECTORS
- Publication number 20160047691
- Publication date Feb 18, 2016
- FLIR SYSTEMS, INC.
- Gregory A. Carlson
- G01 - MEASURING TESTING
Information Patent Application
WAFER LEVEL PACKAGING OF REDUCED-HEIGHT INFRARED DETECTORS
- Publication number 20150358558
- Publication date Dec 10, 2015
- FLIR SYSTEMS, INC.
- Tiahaar Kurtheru Clayton McKenzie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PACKAGING OF MICROBOLOMETER VACUUM PACKAGE ASSEMBLIES
- Publication number 20140186999
- Publication date Jul 3, 2014
- FLIR SYSTEMS, INC.
- Paul Schweikert
- B81 - MICRO-STRUCTURAL TECHNOLOGY