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Gregory A. Kevern

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  • Johnson City, NY, US
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Patents Grantslast 30 patents

  • Information Patent Grant

    Circuitized substrate with conductive polymer and seed material adh...
    • Patent number 7,332,212
    • Issue date Feb 19, 2008
    • Endicott Interconnect Technologies, Inc.
    • Elizabeth Foster
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Drill stack formation
    • Patent number 7,329,446
    • Issue date Feb 12, 2008
    • International Business Machines Corporation
    • Robert M. Japp
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Composite laminate circuit structure
    • Patent number 7,259,333
    • Issue date Aug 21, 2007
    • International Business Machines Corporation
    • Robert Japp
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Circuitized substrate and method of making same
    • Patent number 7,063,762
    • Issue date Jun 20, 2006
    • Endicott Interconnect Technologies, Inc.
    • Elizabeth Foster
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Method of fabricating a laminate circuit structure
    • Patent number 6,834,426
    • Issue date Dec 28, 2004
    • International Business Machines Corporation
    • Robert M. Japp
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Drill stack formation
    • Patent number 6,669,805
    • Issue date Dec 30, 2003
    • International Business Machines Corporation
    • Robert M. Japp
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Electronic package having an adhesive retaining cavity
    • Patent number 6,395,998
    • Issue date May 28, 2002
    • International Business Machines Corporation
    • Donald S. Farquhar
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    DRILL STACK FORMATION
    • Publication number 20080032155
    • Publication date Feb 7, 2008
    • Robert M. Japp
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Circuitized substrate and method of making same
    • Publication number 20060029781
    • Publication date Feb 9, 2006
    • Endicott Interconnect Technologies, Inc.
    • Elizabeth Foster
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    COMPOSITE LAMINATE CIRCUIT STRUCTURE
    • Publication number 20050048408
    • Publication date Mar 3, 2005
    • International Business Machines Corporation
    • Robert M. Japp
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Circuitized substrate and method of making same
    • Publication number 20050039840
    • Publication date Feb 24, 2005
    • Endicott Interconnect Technologies, Inc.
    • Elizabeth Foster
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Drill stack formation
    • Publication number 20040086741
    • Publication date May 6, 2004
    • Robert M. Japp
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Drill stack formation
    • Publication number 20030022013
    • Publication date Jan 30, 2003
    • International Business Machines Corporation
    • Robert M. Japp
    • B32 - LAYERED PRODUCTS