Gregory A. Young

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O'Fallon, MO, US

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Patents Grantslast 30 patents

Information Patent Grant
Clamping apparatus for cleaving a bonded wafer structure and method...
- Patent number 9,925,755
- Issue date Mar 27, 2018
- Sunedison Semiconductor Limited (UEN201334164H)
- Gregory A. Young
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for cleaving a bonded wafer structure
- Patent number 9,165,802
- Issue date Oct 20, 2015
- Sunedison Semiconductor Limited (UEN201334164H)
- Gregory A. Young
- B32 - LAYERED PRODUCTS
Information Patent Grant
Clamping apparatus for cleaving a bonded wafer structure
- Patent number 9,159,596
- Issue date Oct 13, 2015
- SunEdison Semiconductor Limited
- Gregory A. Young
- B32 - LAYERED PRODUCTS

Patents Applicationslast 30 patents

Information Patent Application
CLAMPING APPARATUS FOR CLEAVING A BONDED WAFER STRUCTURE AND METHOD...
- Publication number 20150375495
- Publication date Dec 31, 2015
- SunEdison Semiconductor Limited (UEN201334164H)
- Gregory A. Young
- B32 - LAYERED PRODUCTS
Information Patent Application
METHODS FOR CLEAVING A BONDED WAFER STRUCTURE
- Publication number 20130105538
- Publication date May 2, 2013
- MEMC Electronic Materials, Inc.
- Gregory A. Young
- B32 - LAYERED PRODUCTS
Information Patent Application
CLAMPING APPARATUS FOR CLEAVING A BONDED WAFER STRUCTURE
- Publication number 20130105539
- Publication date May 2, 2013
- MEMC Electronic Materials, Inc.
- Gregory A. Young
- B32 - LAYERED PRODUCTS