Gregory Allen Stom

Person

Damascus, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Aluminum compatible thin-film resistor (TFR) and manufacturing methods
- Patent number 10,658,453
- Issue date May 19, 2020
- Microchip Technology Incorporated
- Justin Hiroki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin-film resistor (TFR) module with top-side interconnects connect...
- Patent number 10,553,336
- Issue date Feb 4, 2020
- Microchip Technology Incorporated
- Yaojian Leng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory cell with oxide cap and spacer layer for protecting a floati...
- Patent number 10,546,947
- Issue date Jan 28, 2020
- Microchip Technology Incorporated
- Mel Hymas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming shallow trench isolation (STI) structures
- Patent number 9,627,246
- Issue date Apr 18, 2017
- Microchip Technology Incorporated
- Justin Hiroki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for photolithography-free self-aligned reverse active etch
- Patent number 9,589,828
- Issue date Mar 7, 2017
- Microchip Technology Incorporated
- Justin Hiroki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a semiconductor die with multiple depth sh...
- Patent number 8,853,091
- Issue date Oct 7, 2014
- Microchip Technology Incorporated
- Justin H. Sato
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Thin-Film Resistor (TFR) Module With Top-Side Interconnects Connect...
- Publication number 20190392967
- Publication date Dec 26, 2019
- MICROCHIP TECHNOLOGY INCORPORATED
- Yaojian Leng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Aluminum Compatible Thin-Film Resistor (TFR) and Manufacturing Methods
- Publication number 20190386091
- Publication date Dec 19, 2019
- MICROCHIP TECHNOLOGY INCORPORATED
- Justin Hiroki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory Cell With Oxide Cap And Spacer Layer For Protecting A Floati...
- Publication number 20190097027
- Publication date Mar 28, 2019
- MICROCHIP TECHNOLOGY INCORPORATED
- Mel Hymas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING SHALLOW TRENCH ISOLATION (STI) STRUCTURES
- Publication number 20170229340
- Publication date Aug 10, 2017
- MICROCHIP TECHNOLOGY INCORPORATED
- Justin Hiroki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING SHALLOW TRENCH ISOLATION (STI) STRUCTURES
- Publication number 20160365272
- Publication date Dec 15, 2016
- MICROCHIP TECHNOLOGY INCORPORATED
- Justin Hiroki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PHOTOLITHOGRAPHY-FREE SELF-ALIGNED REVERSE ACTIVE ETCH
- Publication number 20160118293
- Publication date Apr 28, 2016
- MICROCHIP TECHNOLOGY INCORPORATED
- Justin Hiroki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPLE DEPTH SHALLOW TRENCH ISOLATION PROCESS
- Publication number 20100184295
- Publication date Jul 22, 2010
- MICROCHIP TECHNOLOGY INCORPORATED
- Justin H. Sato
- H01 - BASIC ELECTRIC ELEMENTS

Gregory Allen Stom

Person

Patents Grantslast 30 patents

Aluminum compatible thin-film resistor (TFR) and manufacturing methods

Thin-film resistor (TFR) module with top-side interconnects connect...

Memory cell with oxide cap and spacer layer for protecting a floati...

Method of forming shallow trench isolation (STI) structures

Method for photolithography-free self-aligned reverse active etch

Method for manufacturing a semiconductor die with multiple depth sh...

Patents Applicationslast 30 patents

Thin-Film Resistor (TFR) Module With Top-Side Interconnects Connect...

Aluminum Compatible Thin-Film Resistor (TFR) and Manufacturing Methods

Memory Cell With Oxide Cap And Spacer Layer For Protecting A Floati...

METHOD OF FORMING SHALLOW TRENCH ISOLATION (STI) STRUCTURES

METHOD OF FORMING SHALLOW TRENCH ISOLATION (STI) STRUCTURES

METHOD FOR PHOTOLITHOGRAPHY-FREE SELF-ALIGNED REVERSE ACTIVE ETCH

MULTIPLE DEPTH SHALLOW TRENCH ISOLATION PROCESS