GREGORY GEORGE

Person

COLCHESTER, VT, US

People

Patents Grantslast 30 patents

Information Patent Grant
Apparatus, system, and method for handling aligned wafer pairs
- Patent number 11,651,983
- Issue date May 16, 2023
- Suss MicroTec Lithography GmbH
- Hale Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and related techniques for handling aligned substrate pairs
- Patent number 11,183,401
- Issue date Nov 23, 2021
- Suss MicroTec Lithography GmbH
- Hale Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Baking device for a wafer coated with a coating containing a solvent
- Patent number 10,825,701
- Issue date Nov 3, 2020
- Suss MicroTec Lithography GmbH
- Gregory George
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus, system, and method for handling aligned wafer pairs
- Patent number 10,825,705
- Issue date Nov 3, 2020
- Suss MicroTec Lithography GmbH
- Hale Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for semiconductor wafer leveling, force balanc...
- Patent number 10,580,678
- Issue date Mar 3, 2020
- Suss Microtec Lithography, GmbH
- Hale Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor bonding apparatus and related techniques
- Patent number 10,319,615
- Issue date Jun 11, 2019
- Suss MicroTec Lithography GmbH
- Gregory George
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Semiconductor bonding apparatus and related techniques
- Patent number 9,875,917
- Issue date Jan 23, 2018
- SUSS MicroTech Lithography GmbH
- Gregory George
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Apparatus and method for aligning and centering wafers
- Patent number 9,859,141
- Issue date Jan 2, 2018
- SUSS MicroTec Lithography GmbH
- Hale Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for semiconductor wafer leveling, force balanc...
- Patent number 9,837,295
- Issue date Dec 5, 2017
- SUSS MicroTec Lithography GmbH
- Hale Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus, system, and method for handling aligned wafer pairs
- Patent number 9,640,418
- Issue date May 2, 2017
- Suss MicroTec Lithography GmbH
- Hale Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Debonding temporarily bonded semiconductor wafers
- Patent number 9,583,374
- Issue date Feb 28, 2017
- SUSS MicroTec Lithography GmbH
- Gregory George
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Debonding temporarily bonded semiconductor wafers
- Patent number 9,472,437
- Issue date Oct 18, 2016
- Suss MicroTec Lithography GmbH
- Gregory George
- B32 - LAYERED PRODUCTS
Information Patent Grant
Bottle supply system and bottle cap adapter
- Patent number 9,458,002
- Issue date Oct 4, 2016
- Suss MicroTec Lithography GmbH
- Oliver Treichel
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Method for thermal-slide debonding of temporary bonded semiconducto...
- Patent number 9,281,229
- Issue date Mar 8, 2016
- Suss MicroTec Lithography GmbH
- Gregory George
- B32 - LAYERED PRODUCTS
Information Patent Grant
Thin wafer carrier
- Patent number 9,159,595
- Issue date Oct 13, 2015
- Suss MicroTec Lithography GmbH
- Daniel T. Hurley
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for temporary bonding of ultra thin wafers
- Patent number 9,064,686
- Issue date Jun 23, 2015
- Suss Microtec Lithography, GmbH
- Gregory George
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Debonding temporarily bonded semiconductor wafers
- Patent number 8,950,459
- Issue date Feb 10, 2015
- Suss MicroTec Lithography GmbH
- Gregory George
- B32 - LAYERED PRODUCTS
Information Patent Grant
Apparatus for thermal-slide debonding of temporary bonded semicondu...
- Patent number 8,919,412
- Issue date Dec 30, 2014
- Suss Microtec Lithography, GmbH
- Gregory George
- B32 - LAYERED PRODUCTS
Information Patent Grant
Device for centering wafers
- Patent number 8,764,026
- Issue date Jul 1, 2014
- Suss Microtec Lithography, GmbH
- Gregory George
- B32 - LAYERED PRODUCTS
Information Patent Grant
Apparatus and method for detaping an adhesive layer from the surfac...
- Patent number 8,574,398
- Issue date Nov 5, 2013
- Suss Microtec Lithography, GmbH
- Gregory George
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Debonding equipment and methods for debonding temporary bonded wafers
- Patent number 8,551,291
- Issue date Oct 8, 2013
- Suss Microtec Lithography, GmbH
- Gregory George
- B32 - LAYERED PRODUCTS
Information Patent Grant
Apparatus for high throughput wafer bonding
- Patent number 8,425,715
- Issue date Apr 23, 2013
- Suss Microtec Lithography, GmbH
- Gregory George
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Debonding equipment and methods for debonding temporary bonded wafers
- Patent number 8,366,873
- Issue date Feb 5, 2013
- Suss Microtec Lithography, GmbH
- Gregory George
- B32 - LAYERED PRODUCTS
Information Patent Grant
Apparatus for mechanically debonding temporary bonded semiconductor...
- Patent number 8,267,143
- Issue date Sep 18, 2012
- Suss Microtec Lithography, GmbH
- Gregory George
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method and apparatus for wafer bonding with enhanced wafer mating
- Patent number 8,147,630
- Issue date Apr 3, 2012
- Suss Microtec Lithography, GmbH
- Gregory George
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Apparatus and method for semiconductor wafer alignment
- Patent number 8,139,219
- Issue date Mar 20, 2012
- Suss Microtec Lithography, GmbH
- Gregory George
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for semiconductor bonding
- Patent number 7,948,034
- Issue date May 24, 2011
- Suss Microtec Lithography, GmbH
- Gregory George
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nanoimprinting apparatus and method
- Patent number 6,829,988
- Issue date Dec 14, 2004
- Suss MicroTec, Inc.
- Gregory A. George
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Automatic modular wafer substrate handling device
- Patent number 6,178,361
- Issue date Jan 23, 2001
- Karl Suss America, Inc.
- Gregory George
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for handling semiconductor wafers
- Patent number 5,622,400
- Issue date Apr 22, 1997
- Karl Suss America, Inc.
- Gregory George
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
APPARATUS, SYSTEM, AND METHOD FOR HANDLING ALIGNED WAFER PAIRS
- Publication number 20210013079
- Publication date Jan 14, 2021
- SUSS MICROTEC LITHOGRAPHY GMBH
- Hale Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Bonding Apparatus and Related Techniques
- Publication number 20180108547
- Publication date Apr 19, 2018
- SUSS MICROTEC LITHOGRAPHY GMBH
- Gregory George
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
Apparatus and Method for Semiconductor Wafer Leveling, Force Balanc...
- Publication number 20180102270
- Publication date Apr 12, 2018
- SUSS MICROTEC LITHOGRAPHY, GMBH
- HALE JOHNSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND RELATED TECHNIQUES FOR HANDLING ALIGNED SUBSTRATE PAIRS
- Publication number 20170372925
- Publication date Dec 28, 2017
- SUSS MICROTEC LITHOGRAPHY GMBH
- Hale Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Bonding Apparatus and Related Techniques
- Publication number 20170243769
- Publication date Aug 24, 2017
- SUSS MICROTEC LITHOGRAPHY GMBH
- Gregory George
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS, SYSTEM, AND METHOD FOR HANDLING ALIGNED WAFER PAIRS
- Publication number 20160336212
- Publication date Nov 17, 2016
- SUSS MICROTEC LITHOGRAPHY GMBH
- Hale Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS, SYSTEM, AND METHOD FOR HANDLING ALIGNED WAFER PAIRS
- Publication number 20160336208
- Publication date Nov 17, 2016
- SUSS MICROTEC LITHOGRAPHY GMBH
- Hale Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Debonding Temporarily Bonded Semiconductor Wafers
- Publication number 20160300747
- Publication date Oct 13, 2016
- SUSS MICROTEC LITHOGRAPHY GMBH
- Gregory George
- B32 - LAYERED PRODUCTS
Information Patent Application
BAKING DEVICE FOR A WAFER COATED WITH A COATING CONTAINING A SOLVENT
- Publication number 20160148823
- Publication date May 26, 2016
- SUSS MICROTEC LITHOGRAPHY GMBH
- Gregory George
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOTTLE SUPPLY SYSTEM AND BOTTLE CAP ADAPTER
- Publication number 20150293453
- Publication date Oct 15, 2015
- SUSS MICROTEC LITHOGRAPHY GMBH
- Oliver TREICHEL
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
METHOD AND APPARATUS FOR TEMPORARY BONDING OF ULTRA THIN WAFERS
- Publication number 20150251396
- Publication date Sep 10, 2015
- SUSS MICROTEC LITHOGRAPHY GMBH
- GREGORY GEORGE
- B32 - LAYERED PRODUCTS
Information Patent Application
SYSTEM AMD METHOD FOR SUBSTRATE HOLDING
- Publication number 20150206783
- Publication date Jul 23, 2015
- SUSS MICROTEC LITHOGRAPHY, GMBH
- HALE JOHNSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Debonding Temporarily Bonded Semiconductor Wafers
- Publication number 20150101744
- Publication date Apr 16, 2015
- SUSS MICROTEC LITHOGRAPHY GMBH
- Gregory George
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD FOR THERMAL-SLIDE DEBONDING OF TEMPORARY BONDED SEMICONDUCTO...
- Publication number 20150083342
- Publication date Mar 26, 2015
- SUSS MICROTEC LITHOGRAPHY, GMBH
- GREGORY GEORGE
- B32 - LAYERED PRODUCTS
Information Patent Application
APPARATUS AND METHOD FOR ALIGNING AND CENTERING WAFERS
- Publication number 20140319786
- Publication date Oct 30, 2014
- SUSS MICROTEC LITHOGRAPHY, GMBH
- HALE JOHNSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR SEMICONDUCTOR WAFER LEVELING, FORCE BALANC...
- Publication number 20140318683
- Publication date Oct 30, 2014
- HALE JOHNSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR TEMPORARY BONDING OF ULTRA THIN WAFERS
- Publication number 20130244400
- Publication date Sep 19, 2013
- SUSS MICROTEC LITHOGRAPHY GMBH
- GREGORY GEORGE
- B32 - LAYERED PRODUCTS
Information Patent Application
Debonding Temporarily Bonded Semiconductor Wafers
- Publication number 20130048224
- Publication date Feb 28, 2013
- Gregory George
- B32 - LAYERED PRODUCTS
Information Patent Application
APPARATUS FOR HIGH THROUGHPUT WAFER BONDING
- Publication number 20120080146
- Publication date Apr 5, 2012
- SUSS MICROTEC LITHOGRAPHY, GMBH
- Gregory George
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR DETAPING AN ADHESIVE LAYER FROM THE SURFAC...
- Publication number 20110290415
- Publication date Dec 1, 2011
- SUSS MICROTEC LITHOGRAPHY GMBH
- GREGORY GEORGE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEBONDING EQUIPMENT AND METHODS FOR DEBONDING TEMPORARY BONDED WAFERS
- Publication number 20110253314
- Publication date Oct 20, 2011
- SUSS MICROTEC LITHOGRAPHY, GMBH
- GREGORY GEORGE
- B32 - LAYERED PRODUCTS
Information Patent Application
DEBONDING EQUIPMENT AND METHODS FOR DEBONDING TEMPORARY BONDED WAFERS
- Publication number 20110253315
- Publication date Oct 20, 2011
- SUSS MICROTEC LITHOGRAPHY, GMBH
- GREGORY GEORGE
- B32 - LAYERED PRODUCTS
Information Patent Application
THIN WAFER CARRIER
- Publication number 20110198817
- Publication date Aug 18, 2011
- SUSS MICROTEC INC
- DANIEL T. HURLEY
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS FOR THERMAL-SLIDE DEBONDING OF TEMPORARY BONDED SEMICONDU...
- Publication number 20110010908
- Publication date Jan 20, 2011
- SUSS MICROTEC INC
- GREGORY GEORGE
- B32 - LAYERED PRODUCTS
Information Patent Application
APPARATUS FOR MECHANICALLY DEBONDING TEMPORARY BONDED SEMICONDUCTOR...
- Publication number 20100263794
- Publication date Oct 21, 2010
- SUSS MICROTEC INC
- GREGORY GEORGE
- B32 - LAYERED PRODUCTS
Information Patent Application
DEVICE FOR CENTERING WAFERS
- Publication number 20100266373
- Publication date Oct 21, 2010
- SUSS MICROTEC INC
- GREGORY GEORGE
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD AND APPARATUS FOR WAFER BONDING WITH ENHANCED WAFER MATING
- Publication number 20100122762
- Publication date May 20, 2010
- SUSS MICROTEC INC
- GREGORY GEORGE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR SEMICONDUCTOR WAFER ALIGNMENT
- Publication number 20090251699
- Publication date Oct 8, 2009
- SUSS MICROTEC INC
- GREGORY GEORGE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR SEMICONDUCTOR BONDING
- Publication number 20070296035
- Publication date Dec 27, 2007
- SUSS MICROTEC INC
- GREGORY GEORGE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANOIMPRINTING APPARATUS AND METHOD
- Publication number 20040226460
- Publication date Nov 18, 2004
- Gregory A. George
- B82 - NANO-TECHNOLOGY

GREGORY GEORGE

Person

Patents Grantslast 30 patents

Apparatus, system, and method for handling aligned wafer pairs

System and related techniques for handling aligned substrate pairs

Baking device for a wafer coated with a coating containing a solvent

Apparatus, system, and method for handling aligned wafer pairs

Apparatus and method for semiconductor wafer leveling, force balanc...

Semiconductor bonding apparatus and related techniques

Semiconductor bonding apparatus and related techniques

Apparatus and method for aligning and centering wafers

Apparatus and method for semiconductor wafer leveling, force balanc...

Apparatus, system, and method for handling aligned wafer pairs

Debonding temporarily bonded semiconductor wafers

Debonding temporarily bonded semiconductor wafers

Bottle supply system and bottle cap adapter

Method for thermal-slide debonding of temporary bonded semiconducto...

Thin wafer carrier

Method and apparatus for temporary bonding of ultra thin wafers

Debonding temporarily bonded semiconductor wafers

Apparatus for thermal-slide debonding of temporary bonded semicondu...

Device for centering wafers

Apparatus and method for detaping an adhesive layer from the surfac...

Debonding equipment and methods for debonding temporary bonded wafers

Apparatus for high throughput wafer bonding

Debonding equipment and methods for debonding temporary bonded wafers

Apparatus for mechanically debonding temporary bonded semiconductor...

Method and apparatus for wafer bonding with enhanced wafer mating

Apparatus and method for semiconductor wafer alignment

Apparatus and method for semiconductor bonding

Nanoimprinting apparatus and method

Automatic modular wafer substrate handling device

Apparatus and method for handling semiconductor wafers

Patents Applicationslast 30 patents

APPARATUS, SYSTEM, AND METHOD FOR HANDLING ALIGNED WAFER PAIRS

Semiconductor Bonding Apparatus and Related Techniques

Apparatus and Method for Semiconductor Wafer Leveling, Force Balanc...

SYSTEM AND RELATED TECHNIQUES FOR HANDLING ALIGNED SUBSTRATE PAIRS

Semiconductor Bonding Apparatus and Related Techniques

APPARATUS, SYSTEM, AND METHOD FOR HANDLING ALIGNED WAFER PAIRS

APPARATUS, SYSTEM, AND METHOD FOR HANDLING ALIGNED WAFER PAIRS

Debonding Temporarily Bonded Semiconductor Wafers

BAKING DEVICE FOR A WAFER COATED WITH A COATING CONTAINING A SOLVENT

BOTTLE SUPPLY SYSTEM AND BOTTLE CAP ADAPTER

METHOD AND APPARATUS FOR TEMPORARY BONDING OF ULTRA THIN WAFERS

SYSTEM AMD METHOD FOR SUBSTRATE HOLDING

Debonding Temporarily Bonded Semiconductor Wafers

METHOD FOR THERMAL-SLIDE DEBONDING OF TEMPORARY BONDED SEMICONDUCTO...

APPARATUS AND METHOD FOR ALIGNING AND CENTERING WAFERS

APPARATUS AND METHOD FOR SEMICONDUCTOR WAFER LEVELING, FORCE BALANC...

METHOD AND APPARATUS FOR TEMPORARY BONDING OF ULTRA THIN WAFERS

Debonding Temporarily Bonded Semiconductor Wafers

APPARATUS FOR HIGH THROUGHPUT WAFER BONDING

APPARATUS AND METHOD FOR DETAPING AN ADHESIVE LAYER FROM THE SURFAC...

DEBONDING EQUIPMENT AND METHODS FOR DEBONDING TEMPORARY BONDED WAFERS

DEBONDING EQUIPMENT AND METHODS FOR DEBONDING TEMPORARY BONDED WAFERS

THIN WAFER CARRIER

APPARATUS FOR THERMAL-SLIDE DEBONDING OF TEMPORARY BONDED SEMICONDU...

APPARATUS FOR MECHANICALLY DEBONDING TEMPORARY BONDED SEMICONDUCTOR...

DEVICE FOR CENTERING WAFERS

METHOD AND APPARATUS FOR WAFER BONDING WITH ENHANCED WAFER MATING

APPARATUS AND METHOD FOR SEMICONDUCTOR WAFER ALIGNMENT

APPARATUS AND METHOD FOR SEMICONDUCTOR BONDING

NANOIMPRINTING APPARATUS AND METHOD