Gregory S. Clemons

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Apparatus for semiconductor package inspection
- Patent number 10,794,840
- Issue date Oct 6, 2020
- Intel Corporation
- Liang Zhang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Solder in cavity interconnection structures
- Patent number 10,468,367
- Issue date Nov 5, 2019
- Intel Corporation
- Chuan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder in cavity interconnection structures
- Patent number 9,530,747
- Issue date Dec 27, 2016
- Intel Corporation
- Chuan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder in cavity interconnection structures
- Patent number 9,006,890
- Issue date Apr 14, 2015
- Intel Corporation
- Chuan Hu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder in cavity interconnection structures
- Patent number 8,936,967
- Issue date Jan 20, 2015
- Intel Corporation
- Chuan Hu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for precise alignment of packaging caps on a substrate
- Patent number 7,584,536
- Issue date Sep 8, 2009
- Intel Corporation
- Gregory S. Clemons
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Process for micro-grooving a polymer alignment layer for a liquid c...
- Patent number 7,297,369
- Issue date Nov 20, 2007
- Intel Corporation
- Gregory S. Clemons
- G02 - OPTICS
Information Patent Grant
Apparatus for precise alignment of packaging caps on a substrate
- Patent number 7,275,312
- Issue date Oct 2, 2007
- Intel Corporation
- Gregory S. Clemons
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Method and apparatus for bonding a wire to a bond pad on a device
- Patent number 6,892,927
- Issue date May 17, 2005
- Intel Corporation
- Christopher L. Rumer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit packaging design and method
- Patent number 6,867,124
- Issue date Mar 15, 2005
- Intel Corporation
- Gregory S. Clemons
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
AN APPARATUS FOR SEMICONDUCTOR PACKAGE INSPECTION
- Publication number 20190339212
- Publication date Nov 7, 2019
- Intel Corporation
- Liang ZHANG
- G02 - OPTICS
Information Patent Application
SOLDER IN CAVITY INTERCONNECTION STRUCTURES
- Publication number 20180151529
- Publication date May 31, 2018
- Intel Corporation
- Chuan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER IN CAVITY INTERCONNECTION STRUCTURES
- Publication number 20160148892
- Publication date May 26, 2016
- Intel Corporation
- Chuan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER IN CAVITY INTERCONNECTION STRUCTURES
- Publication number 20150187727
- Publication date Jul 2, 2015
- Intel Corporation
- Chuan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER IN CAVITY INTERCONNECTION STRUCTURES
- Publication number 20130128484
- Publication date May 23, 2013
- Chaun Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER IN CAVITY INTERCONNECTION STRUCTURES
- Publication number 20120241965
- Publication date Sep 27, 2012
- Chuan Hu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Apparatus and method for precise alignment of packaging caps on a s...
- Publication number 20070257360
- Publication date Nov 8, 2007
- Gregory S. Clemons
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process for micro-grooving a polymer alignment layer for a liquid c...
- Publication number 20050221009
- Publication date Oct 6, 2005
- Gregory S. Clemons
- G02 - OPTICS
Information Patent Application
Apparatus and method for precise alignment of packaging caps on a s...
- Publication number 20040261262
- Publication date Dec 30, 2004
- Gregory S. Clemons
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for bonding a wire to a bond pad on a device
- Publication number 20040211761
- Publication date Oct 28, 2004
- Christopher L. Rumer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Gregory S. Clemons

Person

Patents Grantslast 30 patents

Apparatus for semiconductor package inspection

Solder in cavity interconnection structures

Solder in cavity interconnection structures

Solder in cavity interconnection structures

Solder in cavity interconnection structures

Process for precise alignment of packaging caps on a substrate

Process for micro-grooving a polymer alignment layer for a liquid c...

Apparatus for precise alignment of packaging caps on a substrate

Method and apparatus for bonding a wire to a bond pad on a device

Integrated circuit packaging design and method

Patents Applicationslast 30 patents

AN APPARATUS FOR SEMICONDUCTOR PACKAGE INSPECTION

SOLDER IN CAVITY INTERCONNECTION STRUCTURES

SOLDER IN CAVITY INTERCONNECTION STRUCTURES

SOLDER IN CAVITY INTERCONNECTION STRUCTURES

SOLDER IN CAVITY INTERCONNECTION STRUCTURES

SOLDER IN CAVITY INTERCONNECTION STRUCTURES

Apparatus and method for precise alignment of packaging caps on a s...

Process for micro-grooving a polymer alignment layer for a liquid c...

Apparatus and method for precise alignment of packaging caps on a s...

Method and apparatus for bonding a wire to a bond pad on a device