Gregory S. Constable

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Methods of fabricating low melting point solder reinforced sealant...
- Patent number 9,808,875
- Issue date Nov 7, 2017
- Intel Corporation
- Deepak V. Kulkarni
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible underfill compositions for enhanced reliability
- Patent number 9,458,283
- Issue date Oct 4, 2016
- Intel Corporation
- Dingying Xu
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Methods of fabricating low melting point solder reinforced sealant...
- Patent number 9,254,532
- Issue date Feb 9, 2016
- Intel Corporation
- Deepak V. Kulkarni
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible underfill compositions for enhanced reliability
- Patent number 9,068,067
- Issue date Jun 30, 2015
- Intel Corporation
- Dingying Xu
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Underfill formulation and method of increasing an adhesion property...
- Patent number 8,354,467
- Issue date Jan 15, 2013
- Intel Corporation
- Linda A. Shekhawat
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Underfill formulation and method of increasing an adhesion property...
- Patent number 7,926,697
- Issue date Apr 19, 2011
- Intel Corporation
- Linda Shekhawat
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Microelectronic package with wear resistant coating
- Patent number 7,759,780
- Issue date Jul 20, 2010
- Intel Corporation
- Nirupama Chakrapani
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SWAGING PROCESS FOR COMPLEX INTEGRATED HEAT SPREADERS
- Publication number 20190043778
- Publication date Feb 7, 2019
- Zhizhong TANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FABRICATING LOW MELTING POINT SOLDER REINFORCED SEALANT...
- Publication number 20160151850
- Publication date Jun 2, 2016
- Intel Corporation
- Deepak V. Kulkarni
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE UNDERFILL COMPOSITIONS FOR ENHANCED RELIABILITY
- Publication number 20150284503
- Publication date Oct 8, 2015
- Intel Corporation
- Dingying XU
- C07 - ORGANIC CHEMISTRY
Information Patent Application
FLEXIBLE UNDERFILL COMPOSITIONS FOR ENHANCED RELIABILITY
- Publication number 20120074597
- Publication date Mar 29, 2012
- Dingying Xu
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Methods of fabricating low melting point solder reinforced sealant...
- Publication number 20110159310
- Publication date Jun 30, 2011
- Intel Corporation
- Deepak V. Kulkarni
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
UNDERFILL FORMULATION AND METHOD OF INCREASING AN ADHESION PROPERTY...
- Publication number 20110136941
- Publication date Jun 9, 2011
- Linda A. Shekhawat
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
MICROELECTRONIC PACKAGE WITH WEAR RESISTANT COATING
- Publication number 20100078806
- Publication date Apr 1, 2010
- Nirupama Chakrapani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC PARTICLES FOR LOW TEMPERATURE CURE OF UNDERFILL
- Publication number 20090170247
- Publication date Jul 2, 2009
- Linda A. SHEKHAWAT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNDERFILL FORMULATION AND METHOD OF INCREASING AN ADHESION PROPERTY...
- Publication number 20090076220
- Publication date Mar 19, 2009
- Linda A. Shekhawat
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Gregory S. Constable

Person

Patents Grantslast 30 patents

Methods of fabricating low melting point solder reinforced sealant...

Flexible underfill compositions for enhanced reliability

Methods of fabricating low melting point solder reinforced sealant...

Flexible underfill compositions for enhanced reliability

Underfill formulation and method of increasing an adhesion property...

Underfill formulation and method of increasing an adhesion property...

Microelectronic package with wear resistant coating

Patents Applicationslast 30 patents

SWAGING PROCESS FOR COMPLEX INTEGRATED HEAT SPREADERS

METHODS OF FABRICATING LOW MELTING POINT SOLDER REINFORCED SEALANT...

FLEXIBLE UNDERFILL COMPOSITIONS FOR ENHANCED RELIABILITY

FLEXIBLE UNDERFILL COMPOSITIONS FOR ENHANCED RELIABILITY

Methods of fabricating low melting point solder reinforced sealant...

UNDERFILL FORMULATION AND METHOD OF INCREASING AN ADHESION PROPERTY...

MICROELECTRONIC PACKAGE WITH WEAR RESISTANT COATING

MAGNETIC PARTICLES FOR LOW TEMPERATURE CURE OF UNDERFILL

UNDERFILL FORMULATION AND METHOD OF INCREASING AN ADHESION PROPERTY...