Gregory Turturro

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Controlled bondline thickness attachment mechanism
- Patent number 6,349,465
- Issue date Feb 26, 2002
- Intel Corporation
- Michael Brownell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
C4-GT stand off rigid flex interposer method
- Patent number 6,088,915
- Issue date Jul 18, 2000
- Intel Corporation
- Gregory Turturro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 6,049,124
- Issue date Apr 11, 2000
- Intel Corporation
- George F. Raiser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interface attach mechanism for electrical packages
- Patent number 5,965,937
- Issue date Oct 12, 1999
- Intel Corporation
- Chia-Pin Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MPC module with exposed C4 die and removal thermal plate design
- Patent number 5,936,838
- Issue date Aug 10, 1999
- Intel Corporation
- Mirng-Ji Lii
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
C4-GT stand off rigid flex interposer
- Patent number 5,889,652
- Issue date Mar 30, 1999
- Intel Corporation
- Gregory Turturro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
GT clip design for an electronic packaging assembly
- Patent number 5,883,783
- Issue date Mar 16, 1999
- Intel Corporation
- Gregory Turturro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Controlled bondline thickness attachment mechanism
- Patent number 5,802,707
- Issue date Sep 8, 1998
- Intel Corporation
- Michael Brownell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dissipation of heat through keyboard using a heat pipe
- Patent number 5,513,070
- Issue date Apr 30, 1996
- Intel Corporation
- Hong Xie
- G06 - COMPUTING CALCULATING COUNTING

Gregory Turturro

Person

Patents Grantslast 30 patents

Controlled bondline thickness attachment mechanism

C4-GT stand off rigid flex interposer method

Semiconductor package

Thermal interface attach mechanism for electrical packages

MPC module with exposed C4 die and removal thermal plate design

C4-GT stand off rigid flex interposer

GT clip design for an electronic packaging assembly

Controlled bondline thickness attachment mechanism

Dissipation of heat through keyboard using a heat pipe