Grit Sommer

Person

Grafing Bei Munich, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 9,331,057
- Issue date May 3, 2016
- Infineon Technologies AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module having deflecting conductive layer over a spac...
- Patent number 9,219,034
- Issue date Dec 22, 2015
- Infineon Technologies AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit having a semiconductor substrate with barrier layer
- Patent number 8,581,405
- Issue date Nov 12, 2013
- Infineon Technologies AG
- Stephan Dertinger
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor component including a semiconductor chip and a passiv...
- Patent number 8,471,393
- Issue date Jun 25, 2013
- Infineon Technologies AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate with feedthrough and method for producing the same
- Patent number 8,263,491
- Issue date Sep 11, 2012
- Infineon Technologies AG
- Florian Binder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module having deflecting conductive layer over a spac...
- Patent number 8,178,965
- Issue date May 15, 2012
- Infineon Technologies AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate with feedthrough and method for producing the same
- Patent number 8,048,801
- Issue date Nov 1, 2011
- Infineon Technologies, AG
- Stephan Dertinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit having a semiconductor substrate with a barrier...
- Patent number 7,977,798
- Issue date Jul 12, 2011
- Infineon Technologies AG
- Stephan Dertinger
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Chip carrier with reduced interference signal sensitivity
- Patent number 7,911,026
- Issue date Mar 22, 2011
- Qimonda AG
- Florian Binder
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Module Having Deflecting Conductive Layer Over a Spac...
- Publication number 20120199990
- Publication date Aug 9, 2012
- INFINEON TECHNOLOGIES AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT HAVING A SEMICONDUCTOR SUBSTRATE WITH BARRIER LAYER
- Publication number 20110233630
- Publication date Sep 29, 2011
- INFINEON TECHNOLOGIES AG
- Stephan Dertinger
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20090108401
- Publication date Apr 30, 2009
- INFINEON TECHNOLOGIES AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT HAVING A SEMICONDUCTOR SUBSTRATE WITH A BARRIER...
- Publication number 20090026616
- Publication date Jan 29, 2009
- INFINEON TECHNOLOGIES AG
- Stephan Dertinger
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Substrate with Feedthrough and Method for Producing the Same
- Publication number 20080268638
- Publication date Oct 30, 2008
- INFINEON TECHNOLOGIES AG
- Stephan Dertinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Module
- Publication number 20080224302
- Publication date Sep 18, 2008
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE WITH FEEDTHROUGH AND METHOD FOR PRODUCING THE SAME
- Publication number 20080217784
- Publication date Sep 11, 2008
- Florian Binder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor component including a semiconductor chip and a passiv...
- Publication number 20080135977
- Publication date Jun 12, 2008
- Infineon Technologies AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP CARRIER WITH REDUCED INTERFERENCE SIGNAL SENSITIVITY
- Publication number 20070210417
- Publication date Sep 13, 2007
- QIMONDA AG
- Florian Binder
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Grit Sommer

Person

Patents Grantslast 30 patents

Semiconductor device

Semiconductor module having deflecting conductive layer over a spac...

Integrated circuit having a semiconductor substrate with barrier layer

Semiconductor component including a semiconductor chip and a passiv...

Substrate with feedthrough and method for producing the same

Semiconductor module having deflecting conductive layer over a spac...

Substrate with feedthrough and method for producing the same

Integrated circuit having a semiconductor substrate with a barrier...

Chip carrier with reduced interference signal sensitivity

Patents Applicationslast 30 patents

Semiconductor Module Having Deflecting Conductive Layer Over a Spac...

INTEGRATED CIRCUIT HAVING A SEMICONDUCTOR SUBSTRATE WITH BARRIER LAYER

SEMICONDUCTOR DEVICE

INTEGRATED CIRCUIT HAVING A SEMICONDUCTOR SUBSTRATE WITH A BARRIER...

Substrate with Feedthrough and Method for Producing the Same

Semiconductor Module

SUBSTRATE WITH FEEDTHROUGH AND METHOD FOR PRODUCING THE SAME

Semiconductor component including a semiconductor chip and a passiv...

CHIP CARRIER WITH REDUCED INTERFERENCE SIGNAL SENSITIVITY