Gu Won Ji

Person

Suwon-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Board having multilayer capacitor mounted thereon and multilayer ca...
- Patent number 11,769,633
- Issue date Sep 26, 2023
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Gu Won Ji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer ceramic electronic component and board having the same m...
- Patent number 11,749,462
- Issue date Sep 5, 2023
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Heung Kil Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component and board having the same
- Patent number 11,640,877
- Issue date May 2, 2023
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Heung Kil Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component
- Patent number 11,581,147
- Issue date Feb 14, 2023
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Heung Kil Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component
- Patent number 11,477,891
- Issue date Oct 18, 2022
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Gu Won Ji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer electronic component and board having the same mounted t...
- Patent number 11,309,133
- Issue date Apr 19, 2022
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Heung Kil Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component
- Patent number 11,139,113
- Issue date Oct 5, 2021
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Heung Kil Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component and board having the same mounted thereon
- Patent number 11,133,132
- Issue date Sep 28, 2021
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Heung Kil Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component
- Patent number 11,056,281
- Issue date Jul 6, 2021
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Se Hun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer electronic component
- Patent number 11,017,951
- Issue date May 25, 2021
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Heung Kil Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite electronic component
- Patent number 11,004,608
- Issue date May 11, 2021
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Heung Kil Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer electronic component and board having the same
- Patent number 10,980,124
- Issue date Apr 13, 2021
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Heung Kil Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer ceramic electronic component and interposer included the...
- Patent number 10,879,000
- Issue date Dec 29, 2020
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Gu Won Ji
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component
- Patent number 10,840,022
- Issue date Nov 17, 2020
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Won Chul Sim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component
- Patent number 10,777,356
- Issue date Sep 15, 2020
- Samsung Electro-Mechanics Co., Ltd.
- Heung Kil Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component and board having the same
- Patent number 10,658,118
- Issue date May 19, 2020
- Samsung Electro-Mechanics Co., Ltd.
- Heung Kil Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer electronic component and board having the same
- Patent number 10,650,970
- Issue date May 12, 2020
- Samsung Electro-Mechanics Co., Ltd.
- Heung Kil Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite electronic component and board having the same
- Patent number 10,614,960
- Issue date Apr 7, 2020
- Samsung Electro-Mechanics Co., Ltd.
- Se Hun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer electronic component and board having the same
- Patent number 10,566,137
- Issue date Feb 18, 2020
- Samsung Electro-Mechanics Co., Ltd.
- Se Hun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer electronic component and board having the same
- Patent number 10,460,875
- Issue date Oct 29, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Heung Kil Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite electronic component and board having the same
- Patent number 10,453,616
- Issue date Oct 22, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Se Hun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer electronic component and board having the same
- Patent number 10,438,748
- Issue date Oct 8, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Gu Won Ji
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer electronic component and board having the same
- Patent number 10,398,030
- Issue date Aug 27, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Heung Kil Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer electronic component and board having the same
- Patent number 10,347,425
- Issue date Jul 9, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Heung Kil Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer electronic component and board having the same
- Patent number 10,325,722
- Issue date Jun 18, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Heung Kil Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer electronic component and board having the same
- Patent number 10,204,739
- Issue date Feb 12, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Gu Won Ji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer electronic component and board having the same
- Patent number 10,192,686
- Issue date Jan 29, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Heung Kil Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite electronic component and board having the same
- Patent number 10,128,050
- Issue date Nov 13, 2018
- Samsung Electro-Mechanics Co., Ltd.
- Se Hun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer electronic component and board having the same
- Patent number 10,062,511
- Issue date Aug 28, 2018
- Samsung Electro-Mechanics Co., Ltd.
- Heung Kil Park
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MULTILAYER CERAMIC ELECTRONIC COMPONENT AND BOARD HAVING THE SAME M...
- Publication number 20220216010
- Publication date Jul 7, 2022
- Samsung Electro-Mechanics Co., Ltd.
- Heung Kil Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20220189697
- Publication date Jun 16, 2022
- Samsung Electro-Mechanics Co., Ltd.
- Heung Kil Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND BOARD HAVING THE SAME
- Publication number 20220130613
- Publication date Apr 28, 2022
- Samsung Electro-Mechanics Co., Ltd.
- Heung Kil Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COIL COMPONENT
- Publication number 20220102056
- Publication date Mar 31, 2022
- Samsung Electro-Mechanics Co., Ltd.
- Heung Kil Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOARD HAVING MULTILAYER CAPACITOR MOUNTED THEREON AND MULTILAYER CA...
- Publication number 20210313115
- Publication date Oct 7, 2021
- Samsung Electro-Mechanics Co., Ltd.
- Gu Won JI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER ELECTRONIC COMPONENT AND BOARD HAVING THE SAME MOUNTED T...
- Publication number 20210202175
- Publication date Jul 1, 2021
- Samsung Electro-Mechanics Co., Ltd.
- Heung Kil PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20210092847
- Publication date Mar 25, 2021
- Samsung Electro-Mechanics Co., Ltd.
- Gu Won Ji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOARD HAVING MULTILAYER CAPACITOR MOUNTED THEREON AND MULTILAYER CA...
- Publication number 20210090809
- Publication date Mar 25, 2021
- Samsung Electro-Mechanics Co., Ltd.
- Gu Won JI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND BOARD HAVING THE SAME MOUNTED THEREON
- Publication number 20210065983
- Publication date Mar 4, 2021
- Samsung Electro-Mechanics Co., Ltd.
- Heung Kil Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20200135402
- Publication date Apr 30, 2020
- Samsung Electro-Mechanics Co., Ltd.
- Se Hun PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC ELECTRONIC COMPONENT AND INTERPOSER INCLUDED THE...
- Publication number 20200118745
- Publication date Apr 16, 2020
- Samsung Electro-Mechanics Co., Ltd.
- Gu Won JI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER ELECTRONIC COMPONENT
- Publication number 20200051746
- Publication date Feb 13, 2020
- Samsung Electro-Mechanics Co., Ltd.
- Heung Kil PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20190378656
- Publication date Dec 12, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Won Chul SIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20190341189
- Publication date Nov 7, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Heung Kil PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER ELECTRONIC COMPONENT AND BOARD HAVING THE SAME
- Publication number 20190335588
- Publication date Oct 31, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Heung Kil PARK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20190326059
- Publication date Oct 24, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Heung Kil PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE ELECTRONIC COMPONENT
- Publication number 20190326060
- Publication date Oct 24, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Heung Kil PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND BOARD HAVING THE SAME
- Publication number 20190252121
- Publication date Aug 15, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Heung Kil PARK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER ELECTRONIC COMPONENT AND BOARD HAVING THE SAME
- Publication number 20190221369
- Publication date Jul 18, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Heung Kil PARK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPOSITE ELECTRONIC COMPONENT AND BOARD HAVING THE SAME
- Publication number 20190164697
- Publication date May 30, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Se Hun PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multilayer Electronic Component and Board Having the Same
- Publication number 20190148071
- Publication date May 16, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Gu Won JI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER ELECTRONIC COMPONENT AND BOARD HAVING THE SAME
- Publication number 20190124771
- Publication date Apr 25, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Heung Kil PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER ELECTRONIC COMPONENT AND BOARD HAVING THE SAME
- Publication number 20190103223
- Publication date Apr 4, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Heung Kil PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER ELECTRONIC COMPONENT AND BOARD HAVING THE SAME
- Publication number 20190103221
- Publication date Apr 4, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Se Hun PARK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPOSITE ELECTRONIC COMPONENT AND BOARD HAVING THE SAME
- Publication number 20190096585
- Publication date Mar 28, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Se Hun PARK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT AND BOARD HAVING THE SAME
- Publication number 20190069411
- Publication date Feb 28, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Heung Kil PARK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER ELECTRONIC COMPONENT AND BOARD HAVING THE SAME
- Publication number 20190008036
- Publication date Jan 3, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Heung Kil PARK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER ELECTRONIC COMPONENT AND BOARD HAVING THE SAME
- Publication number 20180323010
- Publication date Nov 8, 2018
- Samsung Electro-Mechanics Co., Ltd.
- Heung Kil PARK
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Board having multilayer capacitor mounted thereon and multilayer ca...

Multilayer ceramic electronic component and board having the same m...

Electronic component and board having the same

Electronic component

Electronic component

Multilayer electronic component and board having the same mounted t...

Electronic component

Electronic component and board having the same mounted thereon

Electronic component

Multilayer electronic component

Composite electronic component

Multilayer electronic component and board having the same

Multilayer ceramic electronic component and interposer included the...

Electronic component

Electronic component

Electronic component and board having the same

Multilayer electronic component and board having the same

Composite electronic component and board having the same

Multilayer electronic component and board having the same

Multilayer electronic component and board having the same

Composite electronic component and board having the same

Multilayer electronic component and board having the same

Multilayer electronic component and board having the same

Multilayer electronic component and board having the same

Multilayer electronic component and board having the same

Multilayer electronic component and board having the same

Multilayer electronic component and board having the same

Composite electronic component and board having the same

Multilayer electronic component and board having the same

Patents Applicationslast 30 patents

MULTILAYER CERAMIC ELECTRONIC COMPONENT AND BOARD HAVING THE SAME M...

ELECTRONIC COMPONENT

ELECTRONIC COMPONENT AND BOARD HAVING THE SAME

COIL COMPONENT

BOARD HAVING MULTILAYER CAPACITOR MOUNTED THEREON AND MULTILAYER CA...

MULTILAYER ELECTRONIC COMPONENT AND BOARD HAVING THE SAME MOUNTED T...

ELECTRONIC COMPONENT

BOARD HAVING MULTILAYER CAPACITOR MOUNTED THEREON AND MULTILAYER CA...

ELECTRONIC COMPONENT AND BOARD HAVING THE SAME MOUNTED THEREON

ELECTRONIC COMPONENT

MULTILAYER CERAMIC ELECTRONIC COMPONENT AND INTERPOSER INCLUDED THE...

MULTILAYER ELECTRONIC COMPONENT

ELECTRONIC COMPONENT

ELECTRONIC COMPONENT

MULTILAYER ELECTRONIC COMPONENT AND BOARD HAVING THE SAME

ELECTRONIC COMPONENT

COMPOSITE ELECTRONIC COMPONENT

ELECTRONIC COMPONENT AND BOARD HAVING THE SAME

MULTILAYER ELECTRONIC COMPONENT AND BOARD HAVING THE SAME

COMPOSITE ELECTRONIC COMPONENT AND BOARD HAVING THE SAME

Multilayer Electronic Component and Board Having the Same

MULTILAYER ELECTRONIC COMPONENT AND BOARD HAVING THE SAME

MULTILAYER ELECTRONIC COMPONENT AND BOARD HAVING THE SAME

MULTILAYER ELECTRONIC COMPONENT AND BOARD HAVING THE SAME

COMPOSITE ELECTRONIC COMPONENT AND BOARD HAVING THE SAME

ELECTRONIC COMPONENT AND BOARD HAVING THE SAME

MULTILAYER ELECTRONIC COMPONENT AND BOARD HAVING THE SAME

MULTILAYER ELECTRONIC COMPONENT AND BOARD HAVING THE SAME