Guan Choon Matthew Nelson TEE

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Malacca, MY

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with bond pad extensions formed on molded appe...
- Patent number 11,081,455
- Issue date Aug 3, 2021
- Infineon Technologies Austria AG
- Chan Lam Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing a package using plateable encapsulant
- Patent number 11,081,417
- Issue date Aug 3, 2021
- Infineon Technologies AG
- Sook Woon Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with plateable encapsulant and a method for m...
- Patent number 10,396,007
- Issue date Aug 27, 2019
- Infineon Technologies AG
- Sook Woon Chan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE FOR A LATERAL POWER TRANSISTOR
- Publication number 20240162136
- Publication date May 16, 2024
- Infineon Technologies Austria AG
- Kok Yau Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device with Bond Pad Extensions Formed on Molded Appe...
- Publication number 20200343205
- Publication date Oct 29, 2020
- Chan Lam Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacturing a package using plateable encapsulant
- Publication number 20190341324
- Publication date Nov 7, 2019
- INFINEON TECHNOLOGIES AG
- Sook Woon CHAN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Manufacturing a package using plateable encapsulant
- Publication number 20170256472
- Publication date Sep 7, 2017
- INFINEON TECHNOLOGIES AG
- Sook Woon CHAN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...