Guangfeng Li

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Shanghai, CN

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Patents Grantslast 30 patents

Information Patent Grant
Package substrate manufacturing method
- Patent number 11,825,607
- Issue date Nov 21, 2023
- Montage Technology (Kunshan) Co., Ltd.
- Meng Mei
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for testing electrical performance of packaged chip
- Patent number 11,393,732
- Issue date Jul 19, 2022
- MONTAGE TECHNOLOGY (KUNSHAN) CO., LTD.
- Meng Mei
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE SUBSTRATE STRUCTURE AND METHOD FOR MANUFACTURING SAME
- Publication number 20220301888
- Publication date Sep 22, 2022
- MONTAGE TECHNOLOGY CO., LTD.
- Meng MEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR TESTING ELECTRICAL PERFORMANCE OF PACKAGED CHIP
- Publication number 20220148932
- Publication date May 12, 2022
- MONTAGE TECHNOLOGY (KUNSHAN) CO., LTD.
- Meng MEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20220141962
- Publication date May 5, 2022
- MONTAGE TECHNOLOGY (KUNSHAN) CO., LTD.
- Meng MEI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Camera Assembly and Electronic Device
- Publication number 20210352198
- Publication date Nov 11, 2021
- Huawei Technologies Co., Ltd
- Wei Tang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE