Guangxu Li

Person

Allen, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Multilayer package substrate with stress buffer
- Patent number 11,784,113
- Issue date Oct 10, 2023
- Texas Instruments Incorporated
- Guangxu Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate with CTE matching barrier ring around microvias
- Patent number 11,270,955
- Issue date Mar 8, 2022
- Texas Instruments Incorporated
- Jaimal Mallory Williamson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having metal posts for stress relief at flatn...
- Patent number 10,748,863
- Issue date Aug 18, 2020
- Texas Instruments Incorporated
- Jaimal Mallory Williamson
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MULTILEVEL PACKAGE SUBSTRATE FOR INTERLEVEL DIELECTRIC CRACK MITIGA...
- Publication number 20250006661
- Publication date Jan 2, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Guangxu Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER PACKAGE SUBSTRATE WITH STRESS BUFFER
- Publication number 20240112997
- Publication date Apr 4, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Guangxu Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONICS DEVICE PACKAGE AND METHODS
- Publication number 20230411262
- Publication date Dec 21, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Osvaldo Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICE PACKAGE WITH INTEGRAL PASSIVE COMPONENT
- Publication number 20230378146
- Publication date Nov 23, 2023
- TEXAS INSTRUMENTS INCORPORATED
- John Carlo Molina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MULTILEVEL PACKAGE SUBSTRATE WITH ELEVATED TR...
- Publication number 20230268259
- Publication date Aug 24, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE WITH CTE MATCHING BARRIER RING AROUND MICROVIAS
- Publication number 20220254735
- Publication date Aug 11, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Jaimal Mallory Williamson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER PACKAGE SUBSTRATE WITH STRESS BUFFER
- Publication number 20210327794
- Publication date Oct 21, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Guangxu Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH IMPROVED DIE PAD AND SOLDER MASK...
- Publication number 20200251436
- Publication date Aug 6, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Jaimal Mallory Williamson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE WITH CTE MATCHING BARRIER RING AROUND MICROVIAS
- Publication number 20200176396
- Publication date Jun 4, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Jaimal Mallory Williamson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES HAVING METAL POSTS FOR STRESS RELIEF AT FLATN...
- Publication number 20180190606
- Publication date Jul 5, 2018
- TEXAS INSTRUMENTS INCORPORATED
- Jaimal Mallory Williamson
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Multilayer package substrate with stress buffer

Package substrate with CTE matching barrier ring around microvias

Semiconductor devices having metal posts for stress relief at flatn...

Patents Applicationslast 30 patents

MULTILEVEL PACKAGE SUBSTRATE FOR INTERLEVEL DIELECTRIC CRACK MITIGA...

MULTILAYER PACKAGE SUBSTRATE WITH STRESS BUFFER

MICROELECTRONICS DEVICE PACKAGE AND METHODS

MICROELECTRONIC DEVICE PACKAGE WITH INTEGRAL PASSIVE COMPONENT

ELECTRONIC DEVICE AND MULTILEVEL PACKAGE SUBSTRATE WITH ELEVATED TR...

PACKAGE SUBSTRATE WITH CTE MATCHING BARRIER RING AROUND MICROVIAS

MULTILAYER PACKAGE SUBSTRATE WITH STRESS BUFFER

SEMICONDUCTOR DEVICE PACKAGE WITH IMPROVED DIE PAD AND SOLDER MASK...

PACKAGE SUBSTRATE WITH CTE MATCHING BARRIER RING AROUND MICROVIAS

SEMICONDUCTOR DEVICES HAVING METAL POSTS FOR STRESS RELIEF AT FLATN...