Guanhua Wang

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Tianjin, CN

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Patents Grantslast 30 patents

Information Patent Grant
Method of making chip-on-lead package
- Patent number 8,642,395
- Issue date Feb 4, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Zhe Li
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MAKING CHIP-ON-LEAD PACKAGE
- Publication number 20100248426
- Publication date Sep 30, 2010
- FREESCALE SEMICONDUCTOR, INC.
- Zhe Li
- H01 - BASIC ELECTRIC ELEMENTS