Gudrun Stranzl

Person

Goedersdorf, AT

People

Patents Grantslast 30 patents

Information Patent Grant
Silicon carbide devices and methods for manufacturing the same
- Patent number 11,282,805
- Issue date Mar 22, 2022
- Infineon Technologies AG
- Michael Roesner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing a silicon carbide containing crystalline subst...
- Patent number 11,077,525
- Issue date Aug 3, 2021
- Infineon Technologies AG
- Michael Roesner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor devices including a metal silicide layer and methods...
- Patent number 11,063,014
- Issue date Jul 13, 2021
- Infineon Technologies AG
- Michael Roesner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit substrate and method for manufacturing the same
- Patent number 10,672,716
- Issue date Jun 2, 2020
- Infineon Technologies AG
- Michael Roesner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for processing a semiconductor workpiece
- Patent number 10,157,765
- Issue date Dec 18, 2018
- Infineon Technologies AG
- Gudrun Stranzl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma dicing of silicon carbide
- Patent number 10,032,670
- Issue date Jul 24, 2018
- Infineon Technologies AG
- Michael Roesner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit substrate and method for manufacturing the same
- Patent number 10,020,264
- Issue date Jul 10, 2018
- Infineon Technologies AG
- Michael Roesner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for simultaneous structuring and chip singulation
- Patent number 10,005,659
- Issue date Jun 26, 2018
- Infineon Technologies AG
- Thomas Grille
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Arrangement and method for manufacturing the same
- Patent number 9,966,277
- Issue date May 8, 2018
- Infineon Technologies AG
- Markus Zundel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming semiconductor devices
- Patent number 9,741,618
- Issue date Aug 22, 2017
- Infineon Technologies AG
- Gudrun Stranzl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of dicing a wafer
- Patent number 9,704,748
- Issue date Jul 11, 2017
- Infineon Technologies AG
- Joerg Ortner
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Method for processing a semiconductor substrate and a method for pr...
- Patent number 9,673,096
- Issue date Jun 6, 2017
- Infineon Technologies AG
- Joachim Hirschler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for simultaneous structuring and chip singulation
- Patent number 9,610,543
- Issue date Apr 4, 2017
- Infineon Technologies AG
- Thomas Grille
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor chip with structured sidewalls
- Patent number 9,496,193
- Issue date Nov 15, 2016
- Infineon Technologies AG
- Michael Roesner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Separation of chips on a substrate
- Patent number 9,490,103
- Issue date Nov 8, 2016
- Infineon Technologies AG
- Manfred Engelhardt
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Kerf preparation for backside metallization
- Patent number 9,455,192
- Issue date Sep 27, 2016
- Infineon Technologies AG
- Michael Roesner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Layer arrangement
- Patent number 9,449,928
- Issue date Sep 20, 2016
- Infineon Technologies AG
- Joachim Hirschler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Singulation of semiconductor dies with contact metallization by ele...
- Patent number 9,449,876
- Issue date Sep 20, 2016
- Infineon Technologies AG
- Michael Roesner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for processing a semiconductor workpiece with metallization
- Patent number 9,293,371
- Issue date Mar 22, 2016
- Infineon Technologies AG
- Anja Reitmeier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of singulating substrates to form semiconductor devices usi...
- Patent number 9,257,342
- Issue date Feb 9, 2016
- Infineon Technologies AG
- Gudrun Stranzl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Separation of chips on a substrate
- Patent number 9,219,011
- Issue date Dec 22, 2015
- Infineon Technologies AG
- Manfred Engelhardt
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method for processing a semiconductor workpiece with metallization
- Patent number 9,093,385
- Issue date Jul 28, 2015
- Infineon Technologies AG
- Anja Gissibl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for processing a semiconductor wafer
- Patent number 9,059,273
- Issue date Jun 16, 2015
- Infineon Technologies AG
- Petra Fischer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Utilization of a metallization scheme as an etching mask
- Patent number 8,772,133
- Issue date Jul 8, 2014
- Infineon Technologies AG
- Manfred Engelhardt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Use of a protection layer to protect a passivation while etching a...
- Patent number 8,748,307
- Issue date Jun 10, 2014
- Infineon Technologies AG
- Joachim Hirschler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming semiconductor devices by singulating a substrate...
- Patent number 8,748,297
- Issue date Jun 10, 2014
- Infineon Technologies AG
- Gudrun Stranzl
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Devices Including a Metal Silicide Layer and Methods...
- Publication number 20190355691
- Publication date Nov 21, 2019
- Michael Roesner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Processing a Silicon Carbide Containing Crystalline Subst...
- Publication number 20190308274
- Publication date Oct 10, 2019
- Michael Roesner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Silicon Carbide Devices and Methods for Manufacturing the Same
- Publication number 20190295981
- Publication date Sep 26, 2019
- Michael Roesner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Substrate and Method for Manufacturing the Same
- Publication number 20180315713
- Publication date Nov 1, 2018
- Michael Roesner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA DICING OF SILICON CARBIDE
- Publication number 20170358494
- Publication date Dec 14, 2017
- INFINEON TECHNOLOGIES AG
- Michael Roesner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Forming Semiconductor Devices
- Publication number 20170194205
- Publication date Jul 6, 2017
- INFINEON TECHNOLOGIES AG
- Gudrun Stranzl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Simultaneous Structuring and Chip Singulation
- Publication number 20170158493
- Publication date Jun 8, 2017
- INFINEON TECHNOLOGIES AG
- Thomas Grille
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHODS FOR PROCESSING A SEMICONDUCTOR WORKPIECE
- Publication number 20170076970
- Publication date Mar 16, 2017
- INFINEON TECHNOLOGIES AG
- Gudrun Stranzl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ARRANGEMENT AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20170076961
- Publication date Mar 16, 2017
- INFINEON TECHNOLOGIES AG
- Markus Zundel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROFILTRATION DEVICE
- Publication number 20170030890
- Publication date Feb 2, 2017
- INFINEON TECHNOLOGIES AG
- Gerald Holweg
- G01 - MEASURING TESTING
Information Patent Application
Method of Dicing a Wafer
- Publication number 20160379884
- Publication date Dec 29, 2016
- INFINEON TECHNOLOGIES AG
- Joerg Ortner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Substrate and Method for Manufacturing the Same
- Publication number 20160322306
- Publication date Nov 3, 2016
- INFINEON TECHNOLOGIES AG
- Michael Roesner
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD FOR PROCESSING A SEMICONDUCTOR SUBSTRATE AND A METHOD FOR PR...
- Publication number 20160141208
- Publication date May 19, 2016
- INFINEON TECHNOLOGIES AG
- Hirschler Joachim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Separation of Chips on a Substrate
- Publication number 20160111255
- Publication date Apr 21, 2016
- INFINEON TECHNOLOGIES AG
- Manfred Engelhardt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PROCESSING A SEMICONDUCTOR WORKPIECE
- Publication number 20150294911
- Publication date Oct 15, 2015
- INFINEON TECHNOLOGIES AG
- Anja Reitmeier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Kerf Preparation for Backside Metallization
- Publication number 20150279740
- Publication date Oct 1, 2015
- INFINEON TECHNOLOGIES AG
- Michael Roesner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Simultaneous Structuring and Chip Singulation
- Publication number 20150217997
- Publication date Aug 6, 2015
- INFINEON TECHNOLOGIES AG
- Thomas Grille
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ARRANGEMENT AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20150221523
- Publication date Aug 6, 2015
- INFINEON TECHNOLOGIES AG
- Markus Zundel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Singulation of Semiconductor Dies with Contact Metallization by Ele...
- Publication number 20150206802
- Publication date Jul 23, 2015
- INFINEON TECHNOLOGIES AG
- Michael Roesner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR PROCESSING A SEMICONDUCTOR WORKPIECE
- Publication number 20150147850
- Publication date May 28, 2015
- INFINEON TECHNOLOGIES AG
- Gudrun Stranzl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR PROCESSING A SEMICONDUCTOR WAFER
- Publication number 20150064877
- Publication date Mar 5, 2015
- INFINEON TECHNOLOGIES AG
- Petra Fischer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Separation of Chips on a Substrate
- Publication number 20150064879
- Publication date Mar 5, 2015
- INFINEON TECHNOLOGIES AG
- Manfred Engelhardt
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
METHOD FOR PROCESSING A SEMICONDUCTOR WORKPIECE
- Publication number 20140357055
- Publication date Dec 4, 2014
- INFINEON TECHNOLOGIES AG
- Anja Gissibl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Forming Semiconductor Devices
- Publication number 20140235035
- Publication date Aug 21, 2014
- INFINEON TECHNOLOGIES AG
- Gudrun Stranzl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAYER ARRANGEMENT
- Publication number 20140225233
- Publication date Aug 14, 2014
- INFINEON TECHNOLOGIES AG
- Joachim Hirschler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PROCESSING A WAFER, AND LAYER ARRANGEMENT
- Publication number 20140061873
- Publication date Mar 6, 2014
- INFINEON TECHNOLOGIES AG
- Joachim Hirschler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UTILIZATION OF A METALLIZATION SCHEME AS AN ETCHING MASK
- Publication number 20130328195
- Publication date Dec 12, 2013
- INFINEON TECHNOLOGIES AG
- Manfred Engelhardt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Forming Semiconductor Devices
- Publication number 20130280888
- Publication date Oct 24, 2013
- INFINEON TECHNOLOGIES AG
- Gudrun Stranzl
- H01 - BASIC ELECTRIC ELEMENTS

Gudrun Stranzl

Person

Patents Grantslast 30 patents

Silicon carbide devices and methods for manufacturing the same

Method of processing a silicon carbide containing crystalline subst...

Semiconductor devices including a metal silicide layer and methods...

Integrated circuit substrate and method for manufacturing the same

Methods for processing a semiconductor workpiece

Plasma dicing of silicon carbide

Integrated circuit substrate and method for manufacturing the same

Method for simultaneous structuring and chip singulation

Arrangement and method for manufacturing the same

Methods of forming semiconductor devices

Method of dicing a wafer

Method for processing a semiconductor substrate and a method for pr...

Method for simultaneous structuring and chip singulation

Semiconductor chip with structured sidewalls

Separation of chips on a substrate

Kerf preparation for backside metallization

Layer arrangement

Singulation of semiconductor dies with contact metallization by ele...

Method for processing a semiconductor workpiece with metallization

Methods of singulating substrates to form semiconductor devices usi...

Separation of chips on a substrate

Method for processing a semiconductor workpiece with metallization

Methods for processing a semiconductor wafer

Utilization of a metallization scheme as an etching mask

Use of a protection layer to protect a passivation while etching a...

Methods of forming semiconductor devices by singulating a substrate...

Patents Applicationslast 30 patents

Semiconductor Devices Including a Metal Silicide Layer and Methods...

Method of Processing a Silicon Carbide Containing Crystalline Subst...

Silicon Carbide Devices and Methods for Manufacturing the Same

Integrated Circuit Substrate and Method for Manufacturing the Same

PLASMA DICING OF SILICON CARBIDE

Methods of Forming Semiconductor Devices

Method for Simultaneous Structuring and Chip Singulation

METHODS FOR PROCESSING A SEMICONDUCTOR WORKPIECE

ARRANGEMENT AND METHOD FOR MANUFACTURING THE SAME

MICROFILTRATION DEVICE

Method of Dicing a Wafer

Integrated Circuit Substrate and Method for Manufacturing the Same

METHOD FOR PROCESSING A SEMICONDUCTOR SUBSTRATE AND A METHOD FOR PR...

Separation of Chips on a Substrate

METHOD FOR PROCESSING A SEMICONDUCTOR WORKPIECE

Kerf Preparation for Backside Metallization

Method for Simultaneous Structuring and Chip Singulation

ARRANGEMENT AND METHOD FOR MANUFACTURING THE SAME

Singulation of Semiconductor Dies with Contact Metallization by Ele...

METHODS FOR PROCESSING A SEMICONDUCTOR WORKPIECE

METHODS FOR PROCESSING A SEMICONDUCTOR WAFER

Separation of Chips on a Substrate

METHOD FOR PROCESSING A SEMICONDUCTOR WORKPIECE

Methods of Forming Semiconductor Devices

LAYER ARRANGEMENT

METHOD FOR PROCESSING A WAFER, AND LAYER ARRANGEMENT

UTILIZATION OF A METALLIZATION SCHEME AS AN ETCHING MASK

Methods of Forming Semiconductor Devices