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Patents Grantslast 30 patents

Information Patent Grant
Chip package with cross-linked thermoplastic dielectric
- Patent number 10,854,547
- Issue date Dec 1, 2020
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip packages and methods for manufacturing a chip package
- Patent number 9,666,452
- Issue date May 30, 2017
- Infineon Technologies AG
- Karl Adolf Dieter Mayer
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CROSS-LINKED THERMOPLASTIC DIELECTRIC FOR CHIP PACKAGE
- Publication number 20190287907
- Publication date Sep 19, 2019
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGES AND METHODS FOR MANUFACTURING A CHIP PACKAGE
- Publication number 20130313719
- Publication date Nov 28, 2013
- INFINEON TECHNOLOGIES AG
- Karl Adolf Dieter MAYER
- H01 - BASIC ELECTRIC ELEMENTS