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Patents Grants
last 30 patents
Information
Patent Grant
Assembly and method for mounting an electronic component to a subst...
Patent number
11,211,304
Issue date
Dec 28, 2021
Infineon Technologies Austria AG
Ralf Otremba
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of producing an SMD package with top side cooling
Patent number
10,903,133
Issue date
Jan 26, 2021
Infineon Technologies Austria AG
Ralf Otremba
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
SMD package with top side cooling
Patent number
10,566,260
Issue date
Feb 18, 2020
Infineon Technologies Austria AG
Ralf Otremba
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor devices with improved thermal and electrical performance
Patent number
10,373,897
Issue date
Aug 6, 2019
Infineon Technologies Austria AG
Ralf Otremba
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaged device comprising non-integer lead pitches and method of m...
Patent number
9,035,437
Issue date
May 19, 2015
Infineon Technologies Austria AG
Ralf Otremba
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Method of Producing an SMD Package with Top Side Cooling
Publication number
20200144150
Publication date
May 7, 2020
Ralf Otremba
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SMD Package with Top Side Cooling
Publication number
20190080980
Publication date
Mar 14, 2019
Infineon Technologies Austria AG
Ralf Otremba
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Assembly and Method for Mounting an Electronic Component to a Subst...
Publication number
20190057923
Publication date
Feb 21, 2019
Infineon Technologies Austria AG
Ralf Otremba
H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information
Patent Application
SEMICONDUCTOR DEVICES WITH IMPROVED THERMAL AND ELECTRICAL PERFORMANCE
Publication number
20170179009
Publication date
Jun 22, 2017
Infineon Technologies Austria AG
Ralf Otremba
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Packaged Device Comprising Non-Integer Lead Pitches and Method of M...
Publication number
20140264798
Publication date
Sep 18, 2014
Infineon Technologies Austria AG
Ralf Otremba
H01 - BASIC ELECTRIC ELEMENTS