Guido ALBERMANN

Person

Hamburg, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit saw bow break point
- Patent number 10,896,878
- Issue date Jan 19, 2021
- NXP B.V.
- Antonius Hendrikus Jozef Kamphuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Variable stealth laser dicing process
- Patent number 10,347,534
- Issue date Jul 9, 2019
- NXP B.V.
- Martin Lapke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma dicing with blade saw patterned underside mask
- Patent number 9,847,258
- Issue date Dec 19, 2017
- NXP B.V.
- Thomas Rohleder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Combination grinding after laser (GAL) and laser on-off function to...
- Patent number 9,812,361
- Issue date Nov 7, 2017
- NXP B.V.
- Hartmut Buenning
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma etching and stealth dicing laser process
- Patent number 9,601,437
- Issue date Mar 21, 2017
- NXP B.V.
- Guido Albermann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus, device and method for wafer dicing
- Patent number 9,349,645
- Issue date May 24, 2016
- NXP B.V.
- Martin Lapke
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Die preparation for wafer-level chip scale package (WLCSP)
- Patent number 8,895,363
- Issue date Nov 25, 2014
- NXP B.V.
- Hartmut Buenning
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High die strength semiconductor wafer processing method and system
- Patent number 8,809,166
- Issue date Aug 19, 2014
- NXP B.V.
- Hartmut Buenning
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits on a wafer and method for separating integrated...
- Patent number 8,415,769
- Issue date Apr 9, 2013
- NXP B.V.
- Heimo Scheucher
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR FORMING A PACKAGED SEMICONDUCTOR DEVICE
- Publication number 20210305095
- Publication date Sep 30, 2021
- NXP B.V.
- Sascha Moeller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUE FOR HANDLING DICED WAFERS OF INTEGRATED CIRCUITS
- Publication number 20210134647
- Publication date May 6, 2021
- NXP B.V.
- Antonius Hendrikus Jozef Kamphuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Saw Bow Break Point
- Publication number 20200402918
- Publication date Dec 24, 2020
- NXP B.V.
- Antonius Hendrikus Jozef Kamphuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VARIABLE STEALTH LASER DICING PROCESS
- Publication number 20190080963
- Publication date Mar 14, 2019
- NXP B.V.
- Martin LAPKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA DICING WITH BLADE SAW PATTERNED UNDERSIDE MASK
- Publication number 20170092540
- Publication date Mar 30, 2017
- NXP B.V.
- Thomas ROHLEDER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER MATERIAL REMOVAL
- Publication number 20160172243
- Publication date Jun 16, 2016
- NXP B.V.
- SASCHA MOELLER
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PLASMA ETCHING AND STEALTH DICING LASER PROCESS
- Publication number 20160071770
- Publication date Mar 10, 2016
- NXP B.V.
- Guido ALBERMANN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS, DEVICE AND METHOD FOR WAFER DICING
- Publication number 20150104931
- Publication date Apr 16, 2015
- NXP B.V.
- Martin Lapke
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
COMBINATION GRINDING AFTER LASER (GAL) AND LASER ON-OFF FUNCTION TO...
- Publication number 20150069578
- Publication date Mar 12, 2015
- NXP B.V.
- Hartmut BUENNING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die Preparation for Wafer-Level Chip Scale Package (WLCSP)
- Publication number 20140264768
- Publication date Sep 18, 2014
- NXP B.V.
- Hartmut Buenning
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DIE STRENGTH SEMICONDUCTOR WAFER PROCESSING METHOD AND SYSTEM
- Publication number 20140179083
- Publication date Jun 26, 2014
- NXP B.V.
- HARTMUT BUENNING
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Integrated Circuits On A Wafer and Method For Separating Integrated...
- Publication number 20100270655
- Publication date Oct 28, 2010
- NXP B.V.
- Heimo Scheucher
- H01 - BASIC ELECTRIC ELEMENTS

Guido ALBERMANN

Person

Patents Grantslast 30 patents

Integrated circuit saw bow break point

Variable stealth laser dicing process

Plasma dicing with blade saw patterned underside mask

Combination grinding after laser (GAL) and laser on-off function to...

Plasma etching and stealth dicing laser process

Apparatus, device and method for wafer dicing

Die preparation for wafer-level chip scale package (WLCSP)

High die strength semiconductor wafer processing method and system

Integrated circuits on a wafer and method for separating integrated...

Patents Applicationslast 30 patents

METHOD FOR FORMING A PACKAGED SEMICONDUCTOR DEVICE

TECHNIQUE FOR HANDLING DICED WAFERS OF INTEGRATED CIRCUITS

Integrated Circuit Saw Bow Break Point

VARIABLE STEALTH LASER DICING PROCESS

PLASMA DICING WITH BLADE SAW PATTERNED UNDERSIDE MASK

WAFER MATERIAL REMOVAL

PLASMA ETCHING AND STEALTH DICING LASER PROCESS

APPARATUS, DEVICE AND METHOD FOR WAFER DICING

COMBINATION GRINDING AFTER LASER (GAL) AND LASER ON-OFF FUNCTION TO...

Die Preparation for Wafer-Level Chip Scale Package (WLCSP)

HIGH DIE STRENGTH SEMICONDUCTOR WAFER PROCESSING METHOD AND SYSTEM

Integrated Circuits On A Wafer and Method For Separating Integrated...