Guido Bönig

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Warstein, DE

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Patents Grantslast 30 patents

Information Patent Grant
Printed circuit board, power semiconductor module arrangement compr...
- Patent number 12,002,740
- Issue date Jun 4, 2024
- Infineon Technologies AG
- Sebastian Michalski
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR FORMING A TERMINAL ELEMENT, TERMINAL ELEMENT, AND POWER...
- Publication number 20240266260
- Publication date Aug 8, 2024
- InfineonTechnologies AG
- Olaf Rüdiger Hohlfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Module Comprising a First and a Second Compartm...
- Publication number 20240071853
- Publication date Feb 29, 2024
- INFINEON TECHNOLOGIES AG
- Hans Hartung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE ARRANGEMENT AND METHODS FOR PRODUCING A...
- Publication number 20230253291
- Publication date Aug 10, 2023
- INFINEON TECHNOLOGIES AG
- Matthias Lassmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Printed Circuit Board, Power Semiconductor Module Arrangement Compr...
- Publication number 20230238314
- Publication date Jul 27, 2023
- INFINEON TECHNOLOGIES AG
- Sebastian Michalski
- H01 - BASIC ELECTRIC ELEMENTS