Guido Martinus Henricus KNIPPELS

Person

Beuningen, NL

People

Patents Grantslast 30 patents

Information Patent Grant
Method and apparatus for laser machining
- Patent number 10,493,559
- Issue date Dec 3, 2019
- FEI Company
- Marcus Straw
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and device for grooving wafers
- Patent number 10,340,170
- Issue date Jul 2, 2019
- ASM Technology Singapore Pte. Ltd.
- Richard Van Lieshout
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser fiber array for singulating semiconductor wafers
- Patent number 10,307,867
- Issue date Jun 4, 2019
- ASM Technology Singapore Pte. Ltd.
- Franz Hollinger
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for cutting a wafer that is substantially cove...
- Patent number 10,134,650
- Issue date Nov 20, 2018
- ASM Technology Singapore Pte. Ltd.
- Guido Knippels
- G05 - CONTROLLING REGULATING
Information Patent Grant
Adjustable spatial filter for laser scribing apparatus
- Patent number 10,096,498
- Issue date Oct 9, 2018
- ASM Technology Singapore Pte. Ltd.
- Ivo Libertus Adrianus Johannes Maria Pullens
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for scribing a substantially planar semiconduc...
- Patent number 9,592,574
- Issue date Mar 14, 2017
- ASM Technology Singapore Pte. Ltd.
- Guido Martinus Henricus Knippels
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of protecting a mounting tape during laser singulation of a...
- Patent number 9,449,877
- Issue date Sep 20, 2016
- ASM Technology Singapore Pte. Ltd.
- Frank Ernst
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of dicing thin semiconductor substrates
- Patent number 9,312,178
- Issue date Apr 12, 2016
- ASM Technology Singapore Pte. Ltd.
- Karel Maykel Richard Van Der Stam
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of singulating a thin semiconductor wafer
- Patent number 8,785,298
- Issue date Jul 22, 2014
- ASM Technology Singapore Pte. Ltd.
- Karel Maykel Richard Van der Stam
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Beam blanker for interrupting a beam of charged particles
- Patent number 8,569,712
- Issue date Oct 29, 2013
- FEI Company
- Guido Martinus Henricus Knippels
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE CUTTING CONTROL AND INSPECTION
- Publication number 20180311762
- Publication date Nov 1, 2018
- ASM Technology Singapore Pte Ltd
- Karel Maykel Richard VAN DER STAM
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS AND METHOD FOR CUTTING A WAFER THAT IS SUBSTANTIALLY COVE...
- Publication number 20170243796
- Publication date Aug 24, 2017
- ASM Technology Singapore Pte Ltd
- Guido KNIPPELS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND DEVICE FOR GROOVING WAFERS
- Publication number 20170236738
- Publication date Aug 17, 2017
- ASM Technology Singapore Pte Ltd
- Richard VAN LIESHOUT
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER FIBER ARRAY FOR SINGULATING SEMICONDUCTOR WAFERS
- Publication number 20160121426
- Publication date May 5, 2016
- Franz HOLLINGER
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF PROTECTING A MOUNTING TAPE DURING LASER SINGULATION OF A...
- Publication number 20160079118
- Publication date Mar 17, 2016
- Frank ERNST
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF DICING THIN SEMICONDUCTOR SUBSTRATES
- Publication number 20160013105
- Publication date Jan 14, 2016
- ASM Technology Singapore Pte Ltd
- Karel Maykel Richard VAN DER STAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADJUSTABLE SPATIAL FILTER FOR LASER SCRIBING APPARATUS
- Publication number 20150104956
- Publication date Apr 16, 2015
- ASM Technology Singapore Pte Ltd
- Ivo Libertus Adrianus Johannes Maria PULLENS
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF SINGULATING A THIN SEMICONDUCTOR WAFER
- Publication number 20130244404
- Publication date Sep 19, 2013
- Advanced Laser SeparationInternational (ALSI) N.V.
- Karel Maykel Richard Van der Stam
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND APPARATUS FOR SCRIBING A SUBSTANTIALLY PLANAR SEMICONDUC...
- Publication number 20130217153
- Publication date Aug 22, 2013
- Advanced Laser Separation International (ALSI) N.V.
- Guido Martinus Henricus KNIPPELS
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method And Apparatus For Laser Machining
- Publication number 20120103945
- Publication date May 3, 2012
- FEI Company
- Marcus Straw
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Guido Martinus Henricus KNIPPELS

Person

Patents Grantslast 30 patents

Method and apparatus for laser machining

Method and device for grooving wafers

Laser fiber array for singulating semiconductor wafers

Apparatus and method for cutting a wafer that is substantially cove...

Adjustable spatial filter for laser scribing apparatus

Method and apparatus for scribing a substantially planar semiconduc...

Method of protecting a mounting tape during laser singulation of a...

Method of dicing thin semiconductor substrates

Method of singulating a thin semiconductor wafer

Beam blanker for interrupting a beam of charged particles

Patents Applicationslast 30 patents

SUBSTRATE CUTTING CONTROL AND INSPECTION

APPARATUS AND METHOD FOR CUTTING A WAFER THAT IS SUBSTANTIALLY COVE...

METHOD AND DEVICE FOR GROOVING WAFERS

LASER FIBER ARRAY FOR SINGULATING SEMICONDUCTOR WAFERS

METHOD OF PROTECTING A MOUNTING TAPE DURING LASER SINGULATION OF A...

METHOD OF DICING THIN SEMICONDUCTOR SUBSTRATES

ADJUSTABLE SPATIAL FILTER FOR LASER SCRIBING APPARATUS

METHOD OF SINGULATING A THIN SEMICONDUCTOR WAFER

METHOD AND APPARATUS FOR SCRIBING A SUBSTANTIALLY PLANAR SEMICONDUC...

Method And Apparatus For Laser Machining