Guizhen Zheng

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Phoenix, AZ, US

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Patents Grantslast 30 patents

Information Patent Grant
Package level noise isolation
- Patent number 7,709,934
- Issue date May 4, 2010
- Intel Corporation
- Xiang Yin Zeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package level integration of antenna and RF front-end module
- Patent number 7,477,197
- Issue date Jan 13, 2009
- Intel Corporation
- Xiang Yin Zeng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
CORE VIA FOR CHIP PACKAGE AND INTERCONNECT
- Publication number 20120180312
- Publication date Jul 19, 2012
- Zhichao Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Core via for chip package and interconnect
- Publication number 20100326716
- Publication date Dec 30, 2010
- Zhichao Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE LEVEL INTEGRATION OF ANTENNA AND RF FRONT-END MODULE
- Publication number 20080158063
- Publication date Jul 3, 2008
- Xiang Yin ZENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Package level noise isolation
- Publication number 20080157294
- Publication date Jul 3, 2008
- Xiang Yin Zeng
- H01 - BASIC ELECTRIC ELEMENTS