Gun-ho Chang

Person

Seoul, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor packages
- Patent number 11,081,425
- Issue date Aug 3, 2021
- Samsung Electronics Co., Ltd.
- Gun-Ho Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of debonding a carrier substrate from a device substrate, ap...
- Patent number 10,872,802
- Issue date Dec 22, 2020
- Samsung Electronics Co., Ltd.
- Gun-Ho Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip and semiconductor package including the same
- Patent number 10,756,062
- Issue date Aug 25, 2020
- Samsung Electronics Co., Ltd.
- Kyoung-Soo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 10,026,724
- Issue date Jul 17, 2018
- Samsung Electronics Co., Ltd.
- Ji-hwang Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for fabricating the same
- Patent number 9,966,364
- Issue date May 8, 2018
- Samsung Electronics Co., Ltd.
- Gun Ho Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 9,899,337
- Issue date Feb 20, 2018
- Samsung Electronics Co., Ltd.
- Gun-ho Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pre-package and methods of manufacturing semiconductor package and...
- Patent number 9,761,477
- Issue date Sep 12, 2017
- Samsung Electronics Co., Ltd.
- Gun-ho Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pre-package and methods of manufacturing semiconductor package and...
- Patent number 9,478,514
- Issue date Oct 25, 2016
- Samsung Electronics Co., Ltd.
- Gun-ho Chang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20200144159
- Publication date May 7, 2020
- Samsung Electronics Co., Ltd.
- Gun-Ho CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20200013753
- Publication date Jan 9, 2020
- Samsung Electronics Co., Ltd.
- Kyoung-Soo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF DEBONDING A CARRIER SUBSTRATE FROM A DEVICE SUBSTRATE, AP...
- Publication number 20190148207
- Publication date May 16, 2019
- Samsung Electronics Co., Ltd.
- Gun-Ho CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20180040590
- Publication date Feb 8, 2018
- Samsung Electronics Co., Ltd.
- Gun Ho CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20180006006
- Publication date Jan 4, 2018
- Samsung Electronics Co., Ltd.
- Ji-hwang Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20170047294
- Publication date Feb 16, 2017
- Samsung Electronics Co., Ltd.
- GUN-HO CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRE-PACKAGE AND METHODS OF MANUFACTURING SEMICONDUCTOR PACKAGE AND...
- Publication number 20170025302
- Publication date Jan 26, 2017
- Samsung Electronics Co., Ltd.
- Gun-ho Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRE-PACKAGE AND METHODS OF MANUFACTURING SEMICONDUCTOR PACKAGE AND...
- Publication number 20160141260
- Publication date May 19, 2016
- Gun-ho Chang
- H01 - BASIC ELECTRIC ELEMENTS

Gun-ho Chang

Person

Patents Grantslast 30 patents

Semiconductor packages

Method of debonding a carrier substrate from a device substrate, ap...

Semiconductor chip and semiconductor package including the same

Semiconductor package and method of manufacturing the same

Semiconductor package and method for fabricating the same

Semiconductor package and manufacturing method thereof

Pre-package and methods of manufacturing semiconductor package and...

Pre-package and methods of manufacturing semiconductor package and...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGES

SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

METHOD OF DEBONDING A CARRIER SUBSTRATE FROM A DEVICE SUBSTRATE, AP...

SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

PRE-PACKAGE AND METHODS OF MANUFACTURING SEMICONDUCTOR PACKAGE AND...

PRE-PACKAGE AND METHODS OF MANUFACTURING SEMICONDUCTOR PACKAGE AND...