Gun Hwi HYUNG

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Suwon-Si, KR

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Patents Grantslast 30 patents

Information Patent Grant
Substrate with electronic component embedded therein
- Patent number 11,490,503
- Issue date Nov 1, 2022
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Chang Hwa Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Coil electronic component
- Patent number 10,902,994
- Issue date Jan 26, 2021
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Chi Seong Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC COMPONENT-EMBEDDED SUBSTRATE
- Publication number 20220301975
- Publication date Sep 22, 2022
- Samsung Electro-Mechanics Co., Ltd.
- Ho Hyung HAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE WITH ELECTRONIC COMPONENT EMBEDDED THEREIN
- Publication number 20220022310
- Publication date Jan 20, 2022
- Samsung Electro-Mechanics Co., Ltd.
- Chang Hwa Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COIL ELECTRONIC COMPONENT
- Publication number 20190115145
- Publication date Apr 18, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Chi Seong KIM
- H01 - BASIC ELECTRIC ELEMENTS