Gunther Mackh

Person

Neumarkt, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Carrier arrangement and method for processing a carrier by generati...
- Patent number 10,748,801
- Issue date Aug 18, 2020
- Infineon Technologies AG
- Gunther Mackh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer and method for processing a wafer
- Patent number 10,600,701
- Issue date Mar 24, 2020
- Infineon Technologies AG
- Gunther Mackh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer and method for processing a wafer
- Patent number 10,090,214
- Issue date Oct 2, 2018
- Infineon Technologies AG
- Gunther Mackh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for integrated inductor
- Patent number 10,008,318
- Issue date Jun 26, 2018
- Infineon Technologies AG
- Gunther Mackh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of dicing a wafer and semiconductor chip
- Patent number 9,911,655
- Issue date Mar 6, 2018
- Infineon Technologies AG
- Markus Brunnbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for manufacturing a chip arrangement, methods for manufactu...
- Patent number 9,576,875
- Issue date Feb 21, 2017
- Infineon Technologies AG
- Reinhard Hess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of dicing a wafer and semiconductor chip
- Patent number 9,570,352
- Issue date Feb 14, 2017
- Infineon Technologies AG
- Markus Brunnbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through substrate features in semiconductor substrates
- Patent number 9,196,670
- Issue date Nov 24, 2015
- Infineon Technologies AG
- Gunther Mackh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for making same
- Patent number 9,159,620
- Issue date Oct 13, 2015
- Infineon Technologies AG
- Gunther Mackh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip comprising a backside metal stack
- Patent number 9,147,624
- Issue date Sep 29, 2015
- Infineon Technologies AG
- Gunther Mackh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip comprising a fill structure
- Patent number 9,040,354
- Issue date May 26, 2015
- Infineon Technologies AG
- Gunther Mackh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Singulation processes
- Patent number 9,040,389
- Issue date May 26, 2015
- Infineon Technologies AG
- Gunther Mackh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for manufacturing a chip arrangement, methods for manufactu...
- Patent number 8,951,915
- Issue date Feb 10, 2015
- Infineon Technologies AG
- Reinhard Hess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making conductive interconnects
- Patent number 8,822,329
- Issue date Sep 2, 2014
- Infineon Technologies AG
- Rainer Leuschner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fusing a laser fuse and method for processing a wafer
- Patent number 8,809,165
- Issue date Aug 19, 2014
- Infineon Technologies AG
- Gunther Mackh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing a plurality of chips
- Patent number 8,785,234
- Issue date Jul 22, 2014
- Infineon Technologies AG
- Gunther Mackh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip comprising a fill structure
- Patent number 8,704,338
- Issue date Apr 22, 2014
- Infineon Technologies AG
- Gunther Mackh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Through substrate features in semiconductor substrates
- Patent number 8,697,574
- Issue date Apr 15, 2014
- Infineon Technologies AG
- Gunther Mackh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for integrated inductor
- Patent number 8,436,707
- Issue date May 7, 2013
- Infineon Technologies AG
- Carsten Ahrens
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding pad for contacting a device
- Patent number 7,816,791
- Issue date Oct 19, 2010
- Infineon Technologies AG
- Carsten Ahrens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit, method for acquiring data and measurement system
- Patent number 7,660,175
- Issue date Feb 9, 2010
- Infineon Technologies AG
- Dieter Kohlert
- G11 - INFORMATION STORAGE
Information Patent Grant
MOS transistor and ESD protective device each having a settable vol...
- Patent number 7,202,527
- Issue date Apr 10, 2007
- Infineon Technologies AG
- Kai Esmark
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a MOS transistor and MOS transistor
- Patent number 6,884,688
- Issue date Apr 26, 2005
- Infineon Technologies AG
- Kai Esmark
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIP WITH CRACK GUIDING STRUCTURE COMBINED WITH CRACK STOP STRUCTURE
- Publication number 20240145408
- Publication date May 2, 2024
- INFINEON TECHNOLOGIES AG
- Maria HEIDENBLUT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING A PLURALITY OF SE...
- Publication number 20230130979
- Publication date Apr 27, 2023
- INFINEON TECHNOLOGIES AG
- Gunther Mackh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER, ELECTRONIC COMPONENT AND METHOD USING LASER PENETRATION AFFE...
- Publication number 20230066813
- Publication date Mar 2, 2023
- INFINEON TECHNOLOGIES AG
- Gunther MACKH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP SEPARATION SUPPORTED BY BACK SIDE TRENCH AND ADHESIVE THEREIN
- Publication number 20220328355
- Publication date Oct 13, 2022
- INFINEON TECHNOLOGIES AG
- Gunther MACKH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP HAVING A CRACK STOP STRUCTURE
- Publication number 20220270985
- Publication date Aug 25, 2022
- Sergey Ananiev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PROGRAMMING A ONE-TIME PROGRAMMABLE STRUCTURE, SEMICONDU...
- Publication number 20200043562
- Publication date Feb 6, 2020
- INFINEON TECHNOLOGIES AG
- Wolfgang LIEBL
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
WAFER AND METHOD FOR PROCESSING A WAFER
- Publication number 20180374766
- Publication date Dec 27, 2018
- INFINEON TECHNOLOGIES AG
- Gunther Mackh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Carrier Arrangement and Method for Processing a Carrier
- Publication number 20180286735
- Publication date Oct 4, 2018
- INFINEON TECHNOLOGIES AG
- Gunther Mackh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF DICING A WAFER AND SEMICONDUCTOR CHIP
- Publication number 20170110371
- Publication date Apr 20, 2017
- INFINEON TECHNOLOGIES AG
- Markus BRUNNBAUER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System and Method for Integrated Inductor
- Publication number 20160372256
- Publication date Dec 22, 2016
- INFINEON TECHNOLOGIES AG
- Gunther Mackh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF DICING A WAFER AND SEMICONDUCTOR CHIP
- Publication number 20160211178
- Publication date Jul 21, 2016
- INFINEON TECHNOLOGIES AG
- Markus BRUNNBAUER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR MANUFACTURING A CHIP ARRANGEMENT, METHODS FOR MANUFACTU...
- Publication number 20150115417
- Publication date Apr 30, 2015
- INFINEON TECHNOLOGIES AG
- Reinhard Hess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR MAKING SAME
- Publication number 20150017801
- Publication date Jan 15, 2015
- INFINEON TECHNOLOGIES AG
- Gunther MACKH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Manufacturing a Plurality of Chips
- Publication number 20140284771
- Publication date Sep 25, 2014
- Gunther Mackh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method for Manufacturing a Semiconductor D...
- Publication number 20140217577
- Publication date Aug 7, 2014
- INFINEON TECHNOLOGIES AG
- Gunther Mackh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Chip Comprising a Fill Structure
- Publication number 20140170836
- Publication date Jun 19, 2014
- INFINEON TECHNOLOGIES AG
- Gunther Mackh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Through Substrate Features in Semiconductor Substrates
- Publication number 20140159196
- Publication date Jun 12, 2014
- INFINEON TECHNOLOGIES AG
- Gunther Mackh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip Having Backside Metal and Method for Manufacturing Same
- Publication number 20140117505
- Publication date May 1, 2014
- INFINEON TECHNOLOGIES AG
- Gunther Mackh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER AND METHOD FOR PROCESSING A WAFER
- Publication number 20140103495
- Publication date Apr 17, 2014
- INFINEON TECHNOLOGIES AG
- Gunther Mackh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Singulation Processes
- Publication number 20140099777
- Publication date Apr 10, 2014
- INFINEON TECHNOLOGIES AG
- Gunther Mackh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for manufacturing a chip arrangement, methods for manufactu...
- Publication number 20140070376
- Publication date Mar 13, 2014
- INFINEON TECHNOLOGIES AG
- Reinhard Hess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FUSING A LASER FUSE AND METHOD FOR PROCESSING A WAFER
- Publication number 20140057412
- Publication date Feb 27, 2014
- INFINEON TECHNOLOGIES AG
- Gunther Mackh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
System and Method for Integrated Inductor
- Publication number 20130239404
- Publication date Sep 19, 2013
- INFINEON TECHNOLOGIES AG
- Carsten Ahrens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip Comprising a Fill Structure
- Publication number 20130075869
- Publication date Mar 28, 2013
- INFINEON TECHNOLOGIES AG
- Gunther Mackh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
System and Method for Integrated Inductor
- Publication number 20110169596
- Publication date Jul 14, 2011
- Carsten Ahrens
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Structure and Method for Making Same
- Publication number 20110073997
- Publication date Mar 31, 2011
- Rainer Leuschner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Through Substrate Features in Semiconductor Substrates
- Publication number 20110073987
- Publication date Mar 31, 2011
- Gunther Mackh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit, Method for Acquiring Data and Measurement System
- Publication number 20090219773
- Publication date Sep 3, 2009
- Dieter Kohlert
- G11 - INFORMATION STORAGE
Information Patent Application
Bonding Pad for Contacting a Device
- Publication number 20080067682
- Publication date Mar 20, 2008
- Carsten Ahrens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOS transistor and ESD protective device
- Publication number 20050001270
- Publication date Jan 6, 2005
- Infineon Technologies AG
- Kai Esmark
- H01 - BASIC ELECTRIC ELEMENTS

Gunther Mackh

Person

Patents Grantslast 30 patents

Carrier arrangement and method for processing a carrier by generati...

Wafer and method for processing a wafer

Wafer and method for processing a wafer

System and method for integrated inductor

Method of dicing a wafer and semiconductor chip

Methods for manufacturing a chip arrangement, methods for manufactu...

Method of dicing a wafer and semiconductor chip

Through substrate features in semiconductor substrates

Semiconductor structure and method for making same

Chip comprising a backside metal stack

Chip comprising a fill structure

Singulation processes

Methods for manufacturing a chip arrangement, methods for manufactu...

Method for making conductive interconnects

Method for fusing a laser fuse and method for processing a wafer

Method for manufacturing a plurality of chips

Chip comprising a fill structure

Through substrate features in semiconductor substrates

System and method for integrated inductor

Bonding pad for contacting a device

Integrated circuit, method for acquiring data and measurement system

MOS transistor and ESD protective device each having a settable vol...

Method for producing a MOS transistor and MOS transistor

Patents Applicationslast 30 patents

CHIP WITH CRACK GUIDING STRUCTURE COMBINED WITH CRACK STOP STRUCTURE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING A PLURALITY OF SE...

WAFER, ELECTRONIC COMPONENT AND METHOD USING LASER PENETRATION AFFE...

CHIP SEPARATION SUPPORTED BY BACK SIDE TRENCH AND ADHESIVE THEREIN

SEMICONDUCTOR CHIP HAVING A CRACK STOP STRUCTURE

METHOD FOR PROGRAMMING A ONE-TIME PROGRAMMABLE STRUCTURE, SEMICONDU...

WAFER AND METHOD FOR PROCESSING A WAFER

Carrier Arrangement and Method for Processing a Carrier

METHOD OF DICING A WAFER AND SEMICONDUCTOR CHIP

System and Method for Integrated Inductor

METHOD OF DICING A WAFER AND SEMICONDUCTOR CHIP

METHODS FOR MANUFACTURING A CHIP ARRANGEMENT, METHODS FOR MANUFACTU...

SEMICONDUCTOR STRUCTURE AND METHOD FOR MAKING SAME

Method for Manufacturing a Plurality of Chips

Semiconductor Device and Method for Manufacturing a Semiconductor D...

Chip Comprising a Fill Structure

Through Substrate Features in Semiconductor Substrates

Chip Having Backside Metal and Method for Manufacturing Same

WAFER AND METHOD FOR PROCESSING A WAFER

Singulation Processes

Methods for manufacturing a chip arrangement, methods for manufactu...

METHOD FOR FUSING A LASER FUSE AND METHOD FOR PROCESSING A WAFER

System and Method for Integrated Inductor

Chip Comprising a Fill Structure

System and Method for Integrated Inductor

Semiconductor Structure and Method for Making Same

Through Substrate Features in Semiconductor Substrates

Integrated Circuit, Method for Acquiring Data and Measurement System

Bonding Pad for Contacting a Device

MOS transistor and ESD protective device