Guo Feng Lian

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Shanghai, CN

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Patents Grantslast 30 patents

Information Patent Grant
Wafer process for molded chip scale package (MCSP) with thick backs...
- Patent number 9,520,380
- Issue date Dec 13, 2016
- Alpha and Omega Semiconductor Incorporated
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer process for molded chip scale package (MCSP) with thick backs...
- Patent number 9,245,861
- Issue date Jan 26, 2016
- Alpha and Omega Semiconductor Incorporated
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Aluminum alloy lead-frame and its use in fabrication of power semic...
- Patent number 8,703,545
- Issue date Apr 22, 2014
- Alpha & Omega Semiconductor, Inc.
- Zhiqiang Niu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WAFER PROCESS FOR MOLDED CHIP SCALE PACKAGE (MCSP) WITH THICK BACKS...
- Publication number 20160079203
- Publication date Mar 17, 2016
- ALPHA & OMEGA SEMICONDUCTOR INCORPORATED
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PROCESS FOR MOLDED CHIP SCALE PACKAGE (MCSP) WITH THICK BACKS...
- Publication number 20140315350
- Publication date Oct 23, 2014
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALUMINUM ALLOY LEAD-FRAME AND ITS USE IN FABRICATION OF POWER SEMIC...
- Publication number 20130221507
- Publication date Aug 29, 2013
- Zhiqiang Niu
- H01 - BASIC ELECTRIC ELEMENTS