Guo Qiang Shen

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Shanghai, CN

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Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit package system with window opening
- Patent number 8,901,439
- Issue date Dec 2, 2014
- Stats Chippac Ltd.
- Chee Keong Chin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrated circuit packaging system with leadframe and method of ma...
- Patent number 8,581,382
- Issue date Nov 12, 2013
- Stats Chippac Ltd.
- Guo Qiang Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with package-on-package and met...
- Patent number 8,207,015
- Issue date Jun 26, 2012
- Stats Chippac Ltd.
- Guo Qiang Shen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pick-up heads and systems for die bonding and related applications
- Patent number 8,037,918
- Issue date Oct 18, 2011
- Stats Chippac, Inc.
- Ya Ping Wang
- B32 - LAYERED PRODUCTS
Information Patent Grant
Integrated circuit package system with support structure for die ov...
- Patent number 7,989,941
- Issue date Aug 2, 2011
- Stats Chippac Ltd.
- Chee Keong Chin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH LEADFRAME AND METHOD OF MA...
- Publication number 20110309530
- Publication date Dec 22, 2011
- Guo Qiang Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PACKAGE-ON-PACKAGE AND MET...
- Publication number 20110266664
- Publication date Nov 3, 2011
- Guo Qiang Shen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH SUPPORT STRUCTURE FOR DIE OV...
- Publication number 20090236751
- Publication date Sep 24, 2009
- Chee Keong Chin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pick-up heads and systems for die bonding and related applications
- Publication number 20080128081
- Publication date Jun 5, 2008
- STATS ChipPAC, Inc.
- Ya Ping Wang
- B32 - LAYERED PRODUCTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH WINDOW OPENING
- Publication number 20080041964
- Publication date Feb 21, 2008
- STATS ChipPAC Ltd.
- Chee Keong Chin
- G06 - COMPUTING CALCULATING COUNTING