Guo YANG

Person

Minsk, BY

People

Patents Grantslast 30 patents

Information Patent Grant
Folding device and heat dissipation apparatus
- Patent number 11,847,003
- Issue date Dec 19, 2023
- Huawei Technologies Co., Ltd.
- Guo Yang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Circuit board, method for manufacturing circuit board, and electron...
- Patent number 11,665,816
- Issue date May 30, 2023
- Huawei Technologies Co., Ltd.
- Zhi Yuan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wireless charging device
- Patent number 11,419,238
- Issue date Aug 16, 2022
- Huawei Technologies Co., Ltd.
- Jiajia Sui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat-conducting assembly and terminal
- Patent number 11,284,537
- Issue date Mar 22, 2022
- Huawei Technologies Co., Ltd.
- Yongfu Sun
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Heat dissipation panel, heat dissipation apparatus, and electronic...
- Patent number 11,272,639
- Issue date Mar 8, 2022
- Huawei Technologies Co., Ltd.
- Guo Yang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Heat dissipation structure for electronic device and electronic device
- Patent number 11,122,710
- Issue date Sep 14, 2021
- Huawei Technologies Co., Ltd.
- Linfang Jin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat dissipation structure for electronic device and electronic device
- Patent number 10,729,036
- Issue date Jul 28, 2020
- Huawei Technologies Co., Ltd.
- Linfang Jin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Circuit Board, Method for Manufacturing Circuit Board, and Electron...
- Publication number 20220183146
- Publication date Jun 9, 2022
- Huawei Technologies Co., Ltd
- Zhi Yuan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Heat Dissipation Panel, Heat Dissipation Apparatus, and Electronic...
- Publication number 20210185852
- Publication date Jun 17, 2021
- Huawei Technologies Co., Ltd
- Guo Yang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
WIRELESS CHARGING DEVICE
- Publication number 20210185854
- Publication date Jun 17, 2021
- HUAWEI TECHNOLOGIES CO., LTD.
- Jiajia Sui
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Folding Device and Heat Dissipation Apparatus
- Publication number 20210109575
- Publication date Apr 15, 2021
- Huawei Technologies Co., Ltd
- Guo Yang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Heat-Conducting Assembly and Terminal
- Publication number 20210007238
- Publication date Jan 7, 2021
- Huawei Technologies Co., Ltd
- Yongfu Sun
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Heat Dissipation Structure for Electronic Device and Electronic Device
- Publication number 20200344915
- Publication date Oct 29, 2020
- Huawei Technologies Co., Ltd
- Linfang Jin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Heat Dissipation Structure for Electronic Device and Electronic Device
- Publication number 20190394905
- Publication date Dec 26, 2019
- HUAWEI TECHNOLOGIES CO., LTD.
- Linfang JIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Person

Patents Grantslast 30 patents

Folding device and heat dissipation apparatus

Circuit board, method for manufacturing circuit board, and electron...

Wireless charging device

Heat-conducting assembly and terminal

Heat dissipation panel, heat dissipation apparatus, and electronic...

Heat dissipation structure for electronic device and electronic device

Heat dissipation structure for electronic device and electronic device

Patents Applicationslast 30 patents

Circuit Board, Method for Manufacturing Circuit Board, and Electron...

Heat Dissipation Panel, Heat Dissipation Apparatus, and Electronic...

WIRELESS CHARGING DEVICE

Folding Device and Heat Dissipation Apparatus

Heat-Conducting Assembly and Terminal

Heat Dissipation Structure for Electronic Device and Electronic Device

Heat Dissipation Structure for Electronic Device and Electronic Device