Guo-Zua Wu

Person

Hsinchu Hsien, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Lens assembly
- Patent number 12,124,016
- Issue date Oct 22, 2024
- Sintai Optical (Shenzhen) Co., Ltd.
- Hsi-Ling Chang
- G02 - OPTICS
Information Patent Grant
Buried metal track and methods forming same
- Patent number 12,125,850
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Pochun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit, system and method of forming the same
- Patent number 12,080,647
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Guo-Huei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC device layout method
- Patent number 12,079,559
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Wei Peng
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,074,168
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Guo-Huei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including recessed interconnect structure
- Patent number 12,033,935
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Guo-Huei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including buried conductive fingers and method...
- Patent number 12,027,461
- Issue date Jul 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Liang Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Buried pad for use with gate-all-around device
- Patent number 12,027,598
- Issue date Jul 2, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Guo-Huei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical camera lens
- Patent number 12,001,079
- Issue date Jun 4, 2024
- Sintai Optical (Shenzhen) Co., Ltd.
- Ming-Huang Tseng
- G02 - OPTICS
Information Patent Grant
Integrated circuit with backside power rail and backside interconnect
- Patent number 11,984,441
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Shih-Wei Peng
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Power rail and signal conducting line arrangement
- Patent number 11,967,596
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Guo-Huei Wu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Lens assembly
- Patent number 11,947,092
- Issue date Apr 2, 2024
- Sintai Optical (Shenzhen) Co., Ltd.
- Hsi-Ling Chang
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Semiconductor device and methods of manufacturing same
- Patent number 11,948,886
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Guo-Huei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including recessed interconnect structure
- Patent number 11,942,420
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Guo-Huei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Signal conducting line arrangements in integrated circuits
- Patent number 11,916,017
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Ling Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Staking nanosheet transistors
- Patent number 11,894,383
- Issue date Feb 6, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Pochun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Active zones with offset in semiconductor cell
- Patent number 11,855,068
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Guo-Huei Wu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrated circuit
- Patent number 11,830,869
- Issue date Nov 28, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jian-Sing Li
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
IC device manufacturing method
- Patent number 11,783,109
- Issue date Oct 10, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Wei Peng
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device having buried logic conductor type of compleme...
- Patent number 11,776,958
- Issue date Oct 3, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Guo-Huei Wu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Power rail and signal line arrangement in integrated circuits havin...
- Patent number 11,764,154
- Issue date Sep 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit
- Patent number 11,710,743
- Issue date Jul 25, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Guo-Huei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lens assembly
- Patent number 11,668,902
- Issue date Jun 6, 2023
- Sintai Optical (Shenzhen) Co., Ltd.
- Guo-Yang Wu
- G02 - OPTICS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,664,380
- Issue date May 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Guo-Huei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit, system and method of forming the same
- Patent number 11,569,168
- Issue date Jan 31, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Guo-Huei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lens device under cover glass and lens assembly
- Patent number 11,513,317
- Issue date Nov 29, 2022
- Sintai Optical (Shenzhen) Co., Ltd.
- Po-Jen Wang
- G02 - OPTICS
Information Patent Grant
Interconnect structure in semiconductor device and method of formin...
- Patent number 11,508,659
- Issue date Nov 22, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Guo-Huei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit and method of manufacturing same
- Patent number 11,508,661
- Issue date Nov 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Pochun Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Lens assembly
- Patent number 11,480,760
- Issue date Oct 25, 2022
- Sintai Optical (Shenzhen) Co., Ltd.
- Guo-Quan Lin
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor device including recessed interconnect structure
- Patent number 11,444,018
- Issue date Sep 13, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Guo-Huei Wu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
POWER RAIL ARRANGEMENTS IN INTEGRATED CIRCUITS HAVING STACKED TRANS...
- Publication number 20240355707
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Chin HOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER DISTRIBUTION STRUCTURE, MANUFACTURING METHOD, AND LAYOUT METHOD
- Publication number 20240303407
- Publication date Sep 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Cheng TZENG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
POWER RAIL AND SIGNAL CONDUCTING LINE ARRANGEMENT
- Publication number 20240274607
- Publication date Aug 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Guo-Huei WU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INTEGRATED CIRCUIT WITH BACKSIDE POWER RAIL AND BACKSIDE INTERCONNECT
- Publication number 20240258298
- Publication date Aug 1, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Shih-Wei Peng
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SAME
- Publication number 20240243065
- Publication date Jul 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Guo-Huei WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING RECESSED INTERCONNECT STRUCTURE
- Publication number 20240222269
- Publication date Jul 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Guo-Huei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240145481
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- POCHUN WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACTIVE ZONES WITH OFFSET IN SEMICONDUCTOR CELL
- Publication number 20240096866
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Guo-Huei WU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INTEGRATED CIRCUIT
- Publication number 20240014203
- Publication date Jan 11, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jian-Sing LI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
POWER RAIL AND SIGNAL LINE ARRANGEMENT IN INTEGRATED CIRCUITS HAVIN...
- Publication number 20240006318
- Publication date Jan 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Liang CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIGNAL CONDUCTING LINE ARRANGEMENTS IN INTEGRATED CIRCUITS
- Publication number 20230402374
- Publication date Dec 14, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Ling CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING SEMICONDUCTOR DEVICE INCLUDING BURIED CONDUCTIVE F...
- Publication number 20230387016
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Liang CHEN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
POWER RAIL AND SIGNAL LINE ARRANGEMENT IN INTEGRATED CIRCUITS HAVIN...
- Publication number 20230387013
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Liang CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC DEVICE LAYOUT METHOD
- Publication number 20230376668
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Wei PENG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INTEGRATED CIRCUIT
- Publication number 20230343784
- Publication date Oct 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Guo-Huei WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT
- Publication number 20230317730
- Publication date Oct 5, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Guo-Huei WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230253406
- Publication date Aug 10, 2023
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Guo-Huei WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT, SYSTEM AND METHOD OF FORMING THE SAME
- Publication number 20230114558
- Publication date Apr 13, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Guo-Huei WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LENS ASSEMBLY
- Publication number 20230108477
- Publication date Apr 6, 2023
- SINTAI OPTICAL (SHENZHEN) CO., LTD.
- Hsi-Ling CHANG
- G02 - OPTICS
Information Patent Application
INTEGRATED CIRCUIT AND METHOD OF MANUFACTURING SAME
- Publication number 20230060387
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Pochun WANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SIGNAL CONDUCTING LINE ARRANGEMENTS IN INTEGRATED CIRCUITS
- Publication number 20230064108
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Ling CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER RAIL AND SIGNAL CONDUCTING LINE ARRANGEMENT
- Publication number 20230045167
- Publication date Feb 9, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Guo-Huei WU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
POWER RAIL AND SIGNAL LINE ARRANGEMENT IN INTEGRATED CIRCUITS HAVIN...
- Publication number 20230036522
- Publication date Feb 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Liang CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BURIED PAD FOR USE WITH GATE-ALL-AROUND DEVICE
- Publication number 20220384598
- Publication date Dec 1, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- Guo-Huei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT
- Publication number 20220367519
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Guo-Huei WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lens Assembly
- Publication number 20220326486
- Publication date Oct 13, 2022
- SINTAI OPTICAL (SHENZHEN) CO., LTD.
- Hsi-Ling Chang
- G02 - OPTICS
Information Patent Application
ACTIVE ZONES WITH OFFSET IN SEMICONDUCTOR CELL
- Publication number 20220310584
- Publication date Sep 29, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Guo-Huei WU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE HAVING BURIED LOGIC CONDUCTOR TYPE OF COMPLEME...
- Publication number 20220310598
- Publication date Sep 29, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Guo-Huei Wu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING RECESSED INTERCONNECT STRUCTURE
- Publication number 20220302027
- Publication date Sep 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Guo-Huei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING RECESSED INTERCONNECT STRUCTURE
- Publication number 20220302026
- Publication date Sep 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Guo-Huei Wu
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Lens assembly

Buried metal track and methods forming same

Integrated circuit, system and method of forming the same

IC device layout method

Semiconductor device and method of manufacturing the same

Semiconductor device including recessed interconnect structure

Semiconductor device including buried conductive fingers and method...

Buried pad for use with gate-all-around device

Optical camera lens

Integrated circuit with backside power rail and backside interconnect

Power rail and signal conducting line arrangement

Lens assembly

Semiconductor device and methods of manufacturing same

Semiconductor device including recessed interconnect structure

Signal conducting line arrangements in integrated circuits

Staking nanosheet transistors

Active zones with offset in semiconductor cell

Integrated circuit

IC device manufacturing method

Semiconductor device having buried logic conductor type of compleme...

Power rail and signal line arrangement in integrated circuits havin...

Integrated circuit

Lens assembly

Semiconductor device and method of manufacturing the same

Integrated circuit, system and method of forming the same

Lens device under cover glass and lens assembly

Interconnect structure in semiconductor device and method of formin...

Integrated circuit and method of manufacturing same

Lens assembly

Semiconductor device including recessed interconnect structure

Patents Applicationslast 30 patents

POWER RAIL ARRANGEMENTS IN INTEGRATED CIRCUITS HAVING STACKED TRANS...

POWER DISTRIBUTION STRUCTURE, MANUFACTURING METHOD, AND LAYOUT METHOD

POWER RAIL AND SIGNAL CONDUCTING LINE ARRANGEMENT

INTEGRATED CIRCUIT WITH BACKSIDE POWER RAIL AND BACKSIDE INTERCONNECT

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SAME

SEMICONDUCTOR DEVICE INCLUDING RECESSED INTERCONNECT STRUCTURE

SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

ACTIVE ZONES WITH OFFSET IN SEMICONDUCTOR CELL

INTEGRATED CIRCUIT

POWER RAIL AND SIGNAL LINE ARRANGEMENT IN INTEGRATED CIRCUITS HAVIN...

SIGNAL CONDUCTING LINE ARRANGEMENTS IN INTEGRATED CIRCUITS

METHOD OF MAKING SEMICONDUCTOR DEVICE INCLUDING BURIED CONDUCTIVE F...

POWER RAIL AND SIGNAL LINE ARRANGEMENT IN INTEGRATED CIRCUITS HAVIN...

IC DEVICE LAYOUT METHOD

INTEGRATED CIRCUIT

INTEGRATED CIRCUIT

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

INTEGRATED CIRCUIT, SYSTEM AND METHOD OF FORMING THE SAME

LENS ASSEMBLY

INTEGRATED CIRCUIT AND METHOD OF MANUFACTURING SAME

SIGNAL CONDUCTING LINE ARRANGEMENTS IN INTEGRATED CIRCUITS

POWER RAIL AND SIGNAL CONDUCTING LINE ARRANGEMENT

POWER RAIL AND SIGNAL LINE ARRANGEMENT IN INTEGRATED CIRCUITS HAVIN...

BURIED PAD FOR USE WITH GATE-ALL-AROUND DEVICE

INTEGRATED CIRCUIT

Lens Assembly

ACTIVE ZONES WITH OFFSET IN SEMICONDUCTOR CELL

SEMICONDUCTOR DEVICE HAVING BURIED LOGIC CONDUCTOR TYPE OF COMPLEME...

SEMICONDUCTOR DEVICE INCLUDING RECESSED INTERCONNECT STRUCTURE

SEMICONDUCTOR DEVICE INCLUDING RECESSED INTERCONNECT STRUCTURE