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Patents Grantslast 30 patents

Information Patent Grant
Cooperative bonding method for a bonding head of a wire bonding mac...
- Patent number 12,237,298
- Issue date Feb 25, 2025
- GUANGDONG UNIVERSITY OF TECHNOLOGY
- Jian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Decoupled XY parallel micro-positioning stage
- Patent number 12,106,999
- Issue date Oct 1, 2024
- GUANGDONG UNIVERSITY OF TECHNOLOGY
- Jian Gao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DECOUPLED XY PARALLEL MICRO-POSITIONING STAGE
- Publication number 20210233800
- Publication date Jul 29, 2021
- Guangdong University of Technology
- Jian GAO
- H01 - BASIC ELECTRIC ELEMENTS