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Guohua Gao

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  • Nantong, CN
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Patents Grantslast 30 patents

  • Information Patent Grant

    Method and structure for wafer-level packaging
    • Patent number 9,922,950
    • Issue date Mar 20, 2018
    • TONGFU MICROELECTRONICS CO., LTD.
    • Guohua Gao
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Method and structure for wafer-level packaging
    • Patent number 9,666,550
    • Issue date May 30, 2017
    • TONGFU MICROELECTRONICS CO., LTD.
    • Guohua Gao
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor packaging structure and forming method therefor
    • Patent number 9,515,010
    • Issue date Dec 6, 2016
    • NANTONG FUJITSU MICROELECTRONICS., LTD.
    • Xin Xia
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Packaging structure
    • Patent number 9,497,862
    • Issue date Nov 15, 2016
    • NANTONG FUJITSU MICROELECTRONICS CO., LTD.
    • Lei Shi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Method for chip package
    • Patent number 9,362,173
    • Issue date Jun 7, 2016
    • Nantong Fujitsu Microelectronics Co., Ltd.
    • Lei Shi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Packaging method
    • Patent number 9,324,583
    • Issue date Apr 26, 2016
    • NANTONG FUJITSU MICROELECTRONICS CO., LTD.
    • Lei Shi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Method for chip packaging
    • Patent number 8,883,627
    • Issue date Nov 11, 2014
    • Nantong Fujitsu Microelectronics Co., Ltd.
    • Lei Shi
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    METHOD AND STRUCTURE FOR WAFER-LEVEL PACKAGING
    • Publication number 20170186717
    • Publication date Jun 29, 2017
    • TONGFU MICROELECTRONICS CO., LTD.
    • GUOHUA GAO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD AND STRUCTURE FOR WAFER-LEVEL PACKAGING
    • Publication number 20160172321
    • Publication date Jun 16, 2016
    • NANTONG FUJITSU MICROELECTRONICS CO., LTD.
    • GUOHUA GAO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Semiconductor Packaging Structure And Forming Method Therefor
    • Publication number 20160043020
    • Publication date Feb 11, 2016
    • Xin XIA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PACKAGING STRUCTURE
    • Publication number 20130301228
    • Publication date Nov 14, 2013
    • NANTONG FUJITSU MICROELECTRONICS CO., LTD.
    • Yujuan Tao
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PACKAGING METHOD
    • Publication number 20130302947
    • Publication date Nov 14, 2013
    • NANTONG FUJITSU MICROELECTRONICS CO., LTD.
    • Yujuan Tao
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD FOR CHIP PACKAGING
    • Publication number 20130280904
    • Publication date Oct 24, 2013
    • NANTONG FUJITSU MICROELECTRONICS CO., LTD.
    • Lei Shi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD FOR CHIP PACKAGE
    • Publication number 20130224910
    • Publication date Aug 29, 2013
    • NANTONG FUJITSU MOCROELECTRONICS CO., LTD.
    • Lei Shi
    • H01 - BASIC ELECTRIC ELEMENTS