Guoliang Chen

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Wuhan, CN

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Patents Grantslast 30 patents

Information Patent Grant
Wafer bonding apparatus and method
- Patent number 11,955,454
- Issue date Apr 9, 2024
- Yangtze Memory Technologies Co., Ltd.
- Guoliang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device flipping apparatus
- Patent number 11,257,706
- Issue date Feb 22, 2022
- Yangtze Memory Technologies Co., Ltd.
- Mengyong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma activation treatment for wafer bonding
- Patent number 10,790,260
- Issue date Sep 29, 2020
- Yangtze Memory Technologies Co., Ltd.
- Mengyong Liu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WAFER BONDING APPARATUS AND METHOD
- Publication number 20240194637
- Publication date Jun 13, 2024
- Yangtze Memory Technologies Co., Ltd.
- Guoliang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR WAFER BONDING
- Publication number 20230135060
- Publication date May 4, 2023
- Yangtze Memory Technologies Co., Ltd.
- Guoliang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BONDING APPARATUS AND METHOD
- Publication number 20230131499
- Publication date Apr 27, 2023
- Yangtze Memory Technologies Co., Ltd.
- Guoliang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA ACTIVATION TREATMENT FOR WAFER BONDING
- Publication number 20200212004
- Publication date Jul 2, 2020
- YANGTZE MEMORY TECHNOLOGIES CO., LTD.
- Mengyong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE FLIPPING APPARATUS
- Publication number 20200126838
- Publication date Apr 23, 2020
- Yangtze Memory Technologies Co., Ltd.
- Mengyong Liu
- H01 - BASIC ELECTRIC ELEMENTS