Guoliang YE

Person

Wuhan, Hubei, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Method of forming metal grid, backside-illuminated image sensor and...
- Patent number 12,243,905
- Issue date Mar 4, 2025
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Guoliang Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip interconnection structure, wafer interconnection structure and...
- Patent number 11,164,840
- Issue date Nov 2, 2021
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Hongsheng Yi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer structure and method for manufacturing the same, and chip str...
- Patent number 11,164,834
- Issue date Nov 2, 2021
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Di Zhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-wafer bonding structure and bonding method
- Patent number 10,930,619
- Issue date Feb 23, 2021
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Guoliang Ye
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DICING METHOD, BONDING METHOD AND DIE
- Publication number 20240332079
- Publication date Oct 3, 2024
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Guoliang YE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20240234476
- Publication date Jul 11, 2024
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Guoliang YE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20240136387
- Publication date Apr 25, 2024
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Guoliang YE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGING METHOD AND CHIP PACKAGING STRUCTURE
- Publication number 20240105532
- Publication date Mar 28, 2024
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Zhigang PAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
- Publication number 20240021470
- Publication date Jan 18, 2024
- WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Tianjian LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE ILLUMINATED IMAGE SENSOR SUBSTRATE AND METHOD FOR MANUFACT...
- Publication number 20240006454
- Publication date Jan 4, 2024
- WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Yan XIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DE...
- Publication number 20230402415
- Publication date Dec 14, 2023
- WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Tian ZENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BONDING STRUCTURE, WAFER BONDING METHOD AND CHIP BONDING STRU...
- Publication number 20230343733
- Publication date Oct 26, 2023
- WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Guoliang YE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER ASSEMBLY HAVING ALIGNMENT MARKS, METHOD FOR FORMING SAME, AND...
- Publication number 20230290732
- Publication date Sep 14, 2023
- WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Guoliang YE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20230154807
- Publication date May 18, 2023
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Guoliang YE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING METAL GRID, BACKSIDE-ILLUMINATED IMAGE SENSOR AND...
- Publication number 20230040031
- Publication date Feb 9, 2023
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Guoliang YE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip Structure, Wafer Structure And Method For Manufacturing The Same
- Publication number 20210020596
- Publication date Jan 21, 2021
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Hongsheng YI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Structure And Method For Manufacturing The Same, And Chip Str...
- Publication number 20200388586
- Publication date Dec 10, 2020
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Di ZHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20200075482
- Publication date Mar 5, 2020
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Guoliang YE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-WAFER BONDING STRUCTURE AND BONDING METHOD
- Publication number 20200075550
- Publication date Mar 5, 2020
- WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Guoliang YE
- H01 - BASIC ELECTRIC ELEMENTS

Guoliang YE

Person

Patents Grantslast 30 patents

Method of forming metal grid, backside-illuminated image sensor and...

Chip interconnection structure, wafer interconnection structure and...

Wafer structure and method for manufacturing the same, and chip str...

Multi-wafer bonding structure and bonding method

Patents Applicationslast 30 patents

DICING METHOD, BONDING METHOD AND DIE

IMAGE SENSOR STRUCTURE AND METHOD OF FABRICATING THE SAME

IMAGE SENSOR STRUCTURE AND METHOD OF FABRICATING THE SAME

CHIP PACKAGING METHOD AND CHIP PACKAGING STRUCTURE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR

BACKSIDE ILLUMINATED IMAGE SENSOR SUBSTRATE AND METHOD FOR MANUFACT...

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DE...

WAFER BONDING STRUCTURE, WAFER BONDING METHOD AND CHIP BONDING STRU...

WAFER ASSEMBLY HAVING ALIGNMENT MARKS, METHOD FOR FORMING SAME, AND...

MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

METHOD OF FORMING METAL GRID, BACKSIDE-ILLUMINATED IMAGE SENSOR AND...

Chip Structure, Wafer Structure And Method For Manufacturing The Same

Wafer Structure And Method For Manufacturing The Same, And Chip Str...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

MULTI-WAFER BONDING STRUCTURE AND BONDING METHOD