Guoliang Ying

Person

Shanghai, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Moderated deformation of a vapor chamber to match a shape of a heat...
- Patent number 11,437,297
- Issue date Sep 6, 2022
- Intel Corporation
- Guoliang Ying
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package protector with integrated guide pin
- Patent number 11,201,420
- Issue date Dec 14, 2021
- Intel Corporation
- Jun Lu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Ground heat sink for dual inline memory module cooling
- Patent number 10,873,145
- Issue date Dec 22, 2020
- Intel Corporation
- Guoliang Ying
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ENHANCED I/O SEMICONDUCTOR CHIP PACKAGE AND COOLING ASSEMBLY HAVING...
- Publication number 20240421025
- Publication date Dec 19, 2024
- Intel Corporation
- Lianchang DU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMMERSION COOLING SYSTEMS, APPARATUS, AND RELATED METHODS
- Publication number 20240260228
- Publication date Aug 1, 2024
- Intel Corporation
- Jimmy Chuang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TECHNOLOGIES FOR ISOLATED HEAT DISSIPATING DEVICES
- Publication number 20230420338
- Publication date Dec 28, 2023
- Intel Corporation
- Prabhakar SUBRAHMANYAM
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PACKAGE PROTECTOR WITH INTEGRATED GUIDE PIN
- Publication number 20220200177
- Publication date Jun 23, 2022
- Intel Corporation
- Jun LU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MODERATED DEFORMATION OF A VAPOR CHAMBER TO MATCH A SHAPE OF A HEAT...
- Publication number 20210280496
- Publication date Sep 9, 2021
- Intel Corporation
- Guoliang YING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE PROTECTOR WITH INTEGRATED GUIDE PIN
- Publication number 20210143566
- Publication date May 13, 2021
- Intel Corporation
- Jun LU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
GROUND HEAT SINK FOR DUAL INLINE MEMORY MODULE COOLING
- Publication number 20190319385
- Publication date Oct 17, 2019
- Intel Corporation
- Guoliang Ying
- H01 - BASIC ELECTRIC ELEMENTS

Guoliang Ying

Person

Patents Grantslast 30 patents

Moderated deformation of a vapor chamber to match a shape of a heat...

Package protector with integrated guide pin

Ground heat sink for dual inline memory module cooling

Patents Applicationslast 30 patents

ENHANCED I/O SEMICONDUCTOR CHIP PACKAGE AND COOLING ASSEMBLY HAVING...

IMMERSION COOLING SYSTEMS, APPARATUS, AND RELATED METHODS

TECHNOLOGIES FOR ISOLATED HEAT DISSIPATING DEVICES

PACKAGE PROTECTOR WITH INTEGRATED GUIDE PIN

MODERATED DEFORMATION OF A VAPOR CHAMBER TO MATCH A SHAPE OF A HEAT...

PACKAGE PROTECTOR WITH INTEGRATED GUIDE PIN

GROUND HEAT SINK FOR DUAL INLINE MEMORY MODULE COOLING