Guoqiang Xing

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Shanghai, CN

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Patents Grantslast 30 patents

Information Patent Grant
Methods for forming single damascene via or trench cavities and for...
- Patent number 7,214,609
- Issue date May 8, 2007
- Texas Instruments Incorporated
- Ping Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual cap layer in damascene interconnection processes
- Patent number 7,129,162
- Issue date Oct 31, 2006
- Texas Instruments Incorporated
- Hyesook Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of patterning a FeRAM capacitor with a sidewall during botto...
- Patent number 6,635,498
- Issue date Oct 21, 2003
- Texas Instruments Incorporated
- Scott R. Summerfelt
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Dual cap layer in damascene interconnection processes
- Publication number 20040127016
- Publication date Jul 1, 2004
- TEXAS INSTRUMENTS INCORPORATED
- Hyesook Hoog
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for forming single damascene via or trench cavities and for...
- Publication number 20040110369
- Publication date Jun 10, 2004
- Ping Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PATTERNING A FERAM CAPACITOR WITH A SIDEWALL DURING BOTTO...
- Publication number 20030119211
- Publication date Jun 26, 2003
- Scott R. Summerfelt
- H01 - BASIC ELECTRIC ELEMENTS