Guotao Wang

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Multi-chip packaging
- Patent number 12,199,085
- Issue date Jan 14, 2025
- Intel Corporation
- Robert L. Sankman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip packaging
- Patent number 11,817,444
- Issue date Nov 14, 2023
- Intel Corporation
- Robert L. Sankman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded thin-film magnetic inductor design for integrated voltage...
- Patent number 11,373,966
- Issue date Jun 28, 2022
- Huawei Technologies Co., Ltd.
- Tae Hong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip packaging
- Patent number 11,348,911
- Issue date May 31, 2022
- Intel Corporation
- Robert L. Sankman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Warpage control for microelectronics packages
- Patent number 11,114,388
- Issue date Sep 7, 2021
- Intel Corporation
- Eric J. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip packaging
- Patent number 10,700,051
- Issue date Jun 30, 2020
- Intel Corporation
- Robert L. Sankman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Warpage control for microelectronics packages
- Patent number 10,256,198
- Issue date Apr 9, 2019
- Intel Corporation
- Eric J. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming stepped bumps and structures formed thereby
- Patent number 7,659,192
- Issue date Feb 9, 2010
- Intel Corporation
- Andrew Yeohi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MULTI-CHIP PACKAGING
- Publication number 20240128256
- Publication date Apr 18, 2024
- Intel Corporation
- Robert L. Sankman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGING
- Publication number 20220231007
- Publication date Jul 21, 2022
- Intel Corporation
- Robert L. Sankman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED THIN-FILM MAGNETIC INDUCTOR DESIGN FOR INTEGRATED VOLTAGE...
- Publication number 20220189889
- Publication date Jun 16, 2022
- Huawei Technologies Co., Ltd
- Tae Hong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGING
- Publication number 20220157803
- Publication date May 19, 2022
- Intel Corporation
- Robert L. Sankman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WARPAGE CONTROL FOR MICROELECTRONICS PACKAGES
- Publication number 20210391281
- Publication date Dec 16, 2021
- Intel Corporation
- ERIC J. LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED THIN-FILM MAGNETIC INDUCTOR DESIGN FOR INTEGRATED VOLTAGE...
- Publication number 20200402934
- Publication date Dec 24, 2020
- Huawei Technologies Co., Ltd
- Tae Hong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGING
- Publication number 20200395352
- Publication date Dec 17, 2020
- Intel Corporation
- Robert L. Sankman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGING
- Publication number 20190371778
- Publication date Dec 5, 2019
- Intel Corporation
- Robert L. Sankman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WARPAGE CONTROL FOR MICROELECTRONICS PACKAGES
- Publication number 20190259713
- Publication date Aug 22, 2019
- Intel Corporation
- ERIC J. LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WARPAGE CONTROL FOR MICROELECTRONICS PACKAGES
- Publication number 20180277492
- Publication date Sep 27, 2018
- Intel Corporation
- ERIC J. LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING STEPPED BUMPS AND STRUCTURES FORMED THEREBY
- Publication number 20080157392
- Publication date Jul 3, 2008
- Andrew Yeohi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of forming stepped bumps and structures formed thereby
- Publication number 20080157356
- Publication date Jul 3, 2008
- Andrew Yeohi
- H01 - BASIC ELECTRIC ELEMENTS

Guotao Wang

Person

Patents Grantslast 30 patents

Multi-chip packaging

Multi-chip packaging

Embedded thin-film magnetic inductor design for integrated voltage...

Multi-chip packaging

Warpage control for microelectronics packages

Multi-chip packaging

Warpage control for microelectronics packages

Methods of forming stepped bumps and structures formed thereby

Patents Applicationslast 30 patents

MULTI-CHIP PACKAGING

MULTI-CHIP PACKAGING

EMBEDDED THIN-FILM MAGNETIC INDUCTOR DESIGN FOR INTEGRATED VOLTAGE...

MULTI-CHIP PACKAGING

WARPAGE CONTROL FOR MICROELECTRONICS PACKAGES

EMBEDDED THIN-FILM MAGNETIC INDUCTOR DESIGN FOR INTEGRATED VOLTAGE...

MULTI-CHIP PACKAGING

MULTI-CHIP PACKAGING

WARPAGE CONTROL FOR MICROELECTRONICS PACKAGES

WARPAGE CONTROL FOR MICROELECTRONICS PACKAGES

METHODS OF FORMING STEPPED BUMPS AND STRUCTURES FORMED THEREBY

Methods of forming stepped bumps and structures formed thereby