Gurjeev Chadha

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Union City, CA, US

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Patents Applicationslast 30 patents

Information Patent Application
Method of Packaging an Integrated Circuit
- Publication number 20210242097
- Publication date Aug 5, 2021
- Carbon, Inc.
- William C. HOLTON
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Application
METHOD OF RAPID ENCAPSULATION OF MICROELECTRONIC DEVICES
- Publication number 20210166954
- Publication date Jun 3, 2021
- Carbon, Inc.
- James Patrick Troise
- B81 - MICRO-STRUCTURAL TECHNOLOGY