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Gurpreet SHINH
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Cupertino, CA, US
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Patents Grants
last 30 patents
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Patent Grant
Low-impedance power delivery for a packaged die
Patent number
9,831,225
Issue date
Nov 28, 2017
NVIDIA Corporation
Gurpreet Shinh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Low-impedance power delivery for a packaged die
Patent number
9,190,396
Issue date
Nov 17, 2015
NVIDIA Corporation
Gurpreet Shinh
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
LOW-IMPEDANCE POWER DELIVERY FOR A PACKAGED DIE
Publication number
20160148915
Publication date
May 26, 2016
NVIDIA Corporation
Gurpreet SHINH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LOW-IMPEDANCE POWER DELIVERY FOR A PACKAGED DIE
Publication number
20140042637
Publication date
Feb 13, 2014
Gurpreet SHINH
H01 - BASIC ELECTRIC ELEMENTS