TREA

Gursharan Singh

Follow

Person

  • Fremont, CA, US
People

Patents Grantslast 30 patents

  • Information Patent Grant

    Semiconductor package and method of fabricating semiconductor package
    • Patent number 11,031,371
    • Issue date Jun 8, 2021
    • SanDisk Information Technology (Shanghai) Co., Ltd.
    • Chin Tien Chiu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor device
    • Patent number 10,811,386
    • Issue date Oct 20, 2020
    • SanDisk Information Technology (Shanghai) Co., Ltd.
    • Chin Tien Chiu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    High yield semiconductor device
    • Patent number 9,240,393
    • Issue date Jan 19, 2016
    • SanDisk Information Technology (Shanghai) Co., Ltd.
    • Cheeman Yu
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20180114777
    • Publication date Apr 26, 2018
    • SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD.
    • Chin Tien Chiu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING SEMICONDUCTOR PACKAGE
    • Publication number 20180114773
    • Publication date Apr 26, 2018
    • SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD.
    • Chin Tien Chiu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    HIGH YIELD SEMICONDUCTOR DEVICE
    • Publication number 20150061157
    • Publication date Mar 5, 2015
    • SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD.
    • Cheeman Yu
    • H01 - BASIC ELECTRIC ELEMENTS