Gurtej S. Sandu

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Boise, ID, US

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Patents Grantslast 30 patents

Information Patent Grant
Barrier layer, IC via, and IC line forming methods
- Patent number 7,538,028
- Issue date May 26, 2009
- Micron Technology, Inc.
- Gurtej S. Sandu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier layer, IC via, and IC line forming methods
- Patent number 7,271,089
- Issue date Sep 18, 2007
- Micron Technology, Inc.
- Gurtej S. Sandu
- H01 - BASIC ELECTRIC ELEMENTS