Guruprasad G. Badakere

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of forming wafer level ground plane...
- Patent number 10,651,139
- Issue date May 12, 2020
- JCET Semiconductor (Shaoxing) Co., Ltd.
- Guruprasad G. Badakere
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming wafer level ground plane...
- Patent number 9,390,991
- Issue date Jul 12, 2016
- STATS ChipPAC Pte. Ltd.
- Guruprasad G. Badakere
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming wafer level ground plane...
- Patent number 8,097,943
- Issue date Jan 17, 2012
- STATS ChipPAC, Ltd.
- Guruprasad G. Badakere
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of providing a thermal dissipation...
- Patent number 7,842,607
- Issue date Nov 30, 2010
- STATS ChipPAC, Ltd.
- Lionel Chien Hui Tay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer level interconnect package utilizing conductive...
- Patent number 7,838,395
- Issue date Nov 23, 2010
- STATS ChipPAC, Ltd.
- Guruprasad G. Badakere
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package
- Patent number 6,979,907
- Issue date Dec 27, 2005
- ST Assembly Test Services Ltd.
- Jian Jun Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and manufacturing method therefor with u...
- Patent number 6,855,573
- Issue date Feb 15, 2005
- ST Assembly Test Services Ltd.
- Jian Jun Li
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device and Method of Forming Wafer Level Ground Plane...
- Publication number 20160293558
- Publication date Oct 6, 2016
- STATS ChipPAC Pte Ltd.
- Guruprasad G. Badakere
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Wafer Level Ground Plane...
- Publication number 20120104601
- Publication date May 3, 2012
- STATS ChipPAC, Ltd.
- Guruprasad G. Badakere
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Wafer Level Ground Plane...
- Publication number 20110024903
- Publication date Feb 3, 2011
- STATS ChipPAC, Ltd.
- Guruprasad G. Badakere
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Wafer Level Ground Plane...
- Publication number 20090146297
- Publication date Jun 11, 2009
- STATS ChipPAC, Ltd.
- Guruprasad G. Badakere
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit package
- Publication number 20050051907
- Publication date Mar 10, 2005
- ST ASSEMBLY TEST SERVICES LTD.
- Jian Jun Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit package and manufacturing method therefor
- Publication number 20040058477
- Publication date Mar 25, 2004
- Jian Jun Li
- H01 - BASIC ELECTRIC ELEMENTS

Guruprasad G. Badakere

Person

Patents Grantslast 30 patents

Semiconductor device and method of forming wafer level ground plane...

Semiconductor device and method of forming wafer level ground plane...

Semiconductor device and method of forming wafer level ground plane...

Semiconductor device and method of providing a thermal dissipation...

Semiconductor wafer level interconnect package utilizing conductive...

Integrated circuit package

Integrated circuit package and manufacturing method therefor with u...

Patents Applicationslast 30 patents

Semiconductor Device and Method of Forming Wafer Level Ground Plane...

Semiconductor Device and Method of Forming Wafer Level Ground Plane...

Semiconductor Device and Method of Forming Wafer Level Ground Plane...

Semiconductor Device and Method of Forming Wafer Level Ground Plane...

Integrated circuit package

Integrated circuit package and manufacturing method therefor