Guy N. Smith

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Cedar Rapids, IA, US

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Patents Grantslast 30 patents

Information Patent Grant
Shielding encapsulation for electrical circuitry
- Patent number 9,545,043
- Issue date Jan 10, 2017
- Rockwell Collins, Inc.
- Brandon C. Hamilton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
PCB external ground plane via conductive coating
- Patent number 8,461,698
- Issue date Jun 11, 2013
- Rockwell Collins, Inc.
- Brandon C. Hamilton
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low modulus stress buffer coating in microelectronic devices
- Patent number 7,635,919
- Issue date Dec 22, 2009
- Rockwell Collins, Inc.
- Guy N. Smith
- H01 - BASIC ELECTRIC ELEMENTS