Guy Perry

Person

Plano, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Apparatuses and methods for storing a data value in a sensing circu...
- Patent number 10,839,870
- Issue date Nov 17, 2020
- Micron Technology, Inc.
- Daniel B. Penney
- G11 - INFORMATION STORAGE
Information Patent Grant
Shifting data in sensing circuitry
- Patent number 10,789,996
- Issue date Sep 29, 2020
- Micron Technology, Inc.
- Daniel B. Penney
- G11 - INFORMATION STORAGE
Information Patent Grant
Column repair in memory
- Patent number 10,418,123
- Issue date Sep 17, 2019
- Micron Technology, Inc.
- Daniel B. Penney
- G11 - INFORMATION STORAGE
Information Patent Grant
Apparatuses and methods for storing a data value in a sensing circu...
- Patent number 10,360,949
- Issue date Jul 23, 2019
- Micron Technology, Inc.
- Daniel B. Penney
- G11 - INFORMATION STORAGE
Information Patent Grant
Shifting data in sensing circuitry
- Patent number 10,242,722
- Issue date Mar 26, 2019
- Micron Technology, Inc.
- Daniel B. Penney
- G11 - INFORMATION STORAGE
Information Patent Grant
Column repair in memory
- Patent number 10,068,664
- Issue date Sep 4, 2018
- Micron Technology, Inc.
- Daniel B. Penney
- G11 - INFORMATION STORAGE
Information Patent Grant
Shifting data in sensing circuitry
- Patent number 9,972,367
- Issue date May 15, 2018
- Micron Technology, Inc.
- Daniel B. Penney
- G11 - INFORMATION STORAGE
Information Patent Grant
Apparatuses and methods for storing a data value in a sensing circu...
- Patent number 9,966,116
- Issue date May 8, 2018
- Micron Technology, Inc.
- Daniel B. Penney
- G11 - INFORMATION STORAGE
Information Patent Grant
Apparatuses and methods for storing a data value in a sensing circu...
- Patent number 9,767,864
- Issue date Sep 19, 2017
- Micron Technology, Inc.
- Daniel B. Penney
- G11 - INFORMATION STORAGE
Information Patent Grant
Method of forming a bond pad structure
- Patent number 7,146,722
- Issue date Dec 12, 2006
- Micron Technology, Inc.
- Guy Perry
- G01 - MEASURING TESTING
Information Patent Grant
Bond pad structure comprising multiple bond pads with metal overlap
- Patent number 7,064,447
- Issue date Jun 20, 2006
- Micron Technology, Inc.
- Guy Perry
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
ACTIVE MATERIALS FOR REDUCING HOT ELECTRON-INDUCED PUNCH-THROUGH AN...
- Publication number 20240312504
- Publication date Sep 19, 2024
- Micron Technology, Inc.
- Guy S. Perry
- G11 - INFORMATION STORAGE
Information Patent Application
APPARATUSES AND METHODS FOR PIN CAPACITANCE REDUCTION INCLUDING BON...
- Publication number 20190363060
- Publication date Nov 28, 2019
- Micron Technology, Inc.
- Michael V. Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUSES AND METHODS FOR STORING A DATA VALUE IN A SENSING CIRCU...
- Publication number 20190341084
- Publication date Nov 7, 2019
- Micron Technology, Inc.
- Daniel B. Penney
- G11 - INFORMATION STORAGE
Information Patent Application
SHIFTING DATA IN SENSING CIRCUITRY
- Publication number 20190221244
- Publication date Jul 18, 2019
- Micron Technology, Inc.
- Daniel B. Penney
- G11 - INFORMATION STORAGE
Information Patent Application
COLUMN REPAIR IN MEMORY
- Publication number 20180374559
- Publication date Dec 27, 2018
- Micron Technology, Inc.
- Daniel B. Penney
- G11 - INFORMATION STORAGE
Information Patent Application
SHIFTING DATA IN SENSING CIRCUITRY
- Publication number 20180261264
- Publication date Sep 13, 2018
- Micron Technology, Inc.
- Daniel B. Penney
- G11 - INFORMATION STORAGE
Information Patent Application
APPARATUSES AND METHODS FOR STORING A DATA VALUE IN A SENSING CIRCU...
- Publication number 20180254071
- Publication date Sep 6, 2018
- Micron Technology, Inc.
- Daniel B. Penney
- G11 - INFORMATION STORAGE
Information Patent Application
SHIFTING DATA IN SENSING CIRCUITRY
- Publication number 20180025759
- Publication date Jan 25, 2018
- Micron Technology, Inc.
- Daniel B. Penney
- G11 - INFORMATION STORAGE
Information Patent Application
APPARATUSES AND METHODS FOR STORING A DATA VALUE IN A SENSING CIRC...
- Publication number 20180025758
- Publication date Jan 25, 2018
- Micron Technology, Inc.
- Daniel B. Penney
- G11 - INFORMATION STORAGE
Information Patent Application
Bond pad structure comprising multiple bond pads with metal overlap
- Publication number 20060250139
- Publication date Nov 9, 2006
- Micron Technology, Inc.
- Guy Perry
- G01 - MEASURING TESTING
Information Patent Application
Bond pad structure comprising multiple bond pads with metal overlap
- Publication number 20030153103
- Publication date Aug 14, 2003
- Micron Technology, Inc.
- Guy Perry
- G01 - MEASURING TESTING
Information Patent Application
Bond pad structure comprising multiple bond pads with metal overlap
- Publication number 20030030153
- Publication date Feb 13, 2003
- Guy Perry
- G01 - MEASURING TESTING

Person

Patents Grantslast 30 patents

Apparatuses and methods for storing a data value in a sensing circu...

Shifting data in sensing circuitry

Column repair in memory

Apparatuses and methods for storing a data value in a sensing circu...

Shifting data in sensing circuitry

Column repair in memory

Shifting data in sensing circuitry

Apparatuses and methods for storing a data value in a sensing circu...

Apparatuses and methods for storing a data value in a sensing circu...

Method of forming a bond pad structure

Bond pad structure comprising multiple bond pads with metal overlap

Patents Applicationslast 30 patents

ACTIVE MATERIALS FOR REDUCING HOT ELECTRON-INDUCED PUNCH-THROUGH AN...

APPARATUSES AND METHODS FOR PIN CAPACITANCE REDUCTION INCLUDING BON...

APPARATUSES AND METHODS FOR STORING A DATA VALUE IN A SENSING CIRCU...

SHIFTING DATA IN SENSING CIRCUITRY

COLUMN REPAIR IN MEMORY

SHIFTING DATA IN SENSING CIRCUITRY

APPARATUSES AND METHODS FOR STORING A DATA VALUE IN A SENSING CIRCU...

SHIFTING DATA IN SENSING CIRCUITRY

APPARATUSES AND METHODS FOR STORING A DATA VALUE IN A SENSING CIRC...

Bond pad structure comprising multiple bond pads with metal overlap

Bond pad structure comprising multiple bond pads with metal overlap

Bond pad structure comprising multiple bond pads with metal overlap