Guy Regev

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Valley Village, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Security circuitry for bonded structures
- Patent number 12,174,246
- Issue date Dec 24, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Javier A. DeLaCruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Security circuitry for bonded structures
- Patent number 11,385,278
- Issue date Jul 12, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Javier A. DeLaCruz
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
SECURITY CIRCUITRY FOR BONDED STRUCTURES
- Publication number 20250199058
- Publication date Jun 19, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Javier A. DeLaCruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SECURITY CIRCUITRY FOR BONDED STRUCTURES
- Publication number 20220373593
- Publication date Nov 24, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Javier A. DeLaCruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SECURITY CIRCUITRY FOR BONDED STRUCTURES
- Publication number 20200371154
- Publication date Nov 26, 2020
- INVENSAS BONDING TECHNOLOGIES, INC.
- Javier A. DeLaCruz
- H01 - BASIC ELECTRIC ELEMENTS