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Ichon-si, KR
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Patents Grants
last 30 patents
Information
Patent Grant
Semiconductor device and method of forming semiconductor package wi...
Patent number
11,894,314
Issue date
Feb 6, 2024
STATS ChipPAC Pte. Ltd.
HunTeak Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Double-sided partial molded SIP module
Patent number
11,887,863
Issue date
Jan 30, 2024
STATS ChipPAC Pte. Ltd.
HunTeak Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming RF FEM with LC filter an...
Patent number
9,704,857
Issue date
Jul 11, 2017
STATS ChipPAC, Pte. Ltd.
HyunTai Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming RF FEM and RF transceive...
Patent number
9,190,340
Issue date
Nov 17, 2015
STATS ChipPAC, Ltd.
YongTaek Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with cross-talk isolation using M-cap
Patent number
9,082,638
Issue date
Jul 14, 2015
STATS ChipPAC, Ltd.
YongTaek Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming shielding layer around b...
Patent number
8,896,115
Issue date
Nov 25, 2014
STATS ChipPAC, Ltd.
YongTaek Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thin package system with external terminals and method of manufactu...
Patent number
8,481,371
Issue date
Jul 9, 2013
Stats Chippac Ltd.
Youngcheol Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming RF FEM with IC filter an...
Patent number
8,349,648
Issue date
Jan 8, 2013
STATS ChipPAC, Ltd.
HyunTai Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with cross-talk isolation using M-cap and meth...
Patent number
8,269,308
Issue date
Sep 18, 2012
STATS ChipPAC, Ltd.
YongTaek Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming shielding layer around b...
Patent number
8,183,130
Issue date
May 22, 2012
STATS ChipPAC, Ltd.
YongTaek Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package system with substrate heat sink
Patent number
8,125,076
Issue date
Feb 28, 2012
Stats Chippac Ltd.
Gwang Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thin package system with external terminals
Patent number
7,947,535
Issue date
May 24, 2011
Stats Chippac Ltd.
Youngcheol Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked integrated circuit package-in-package system
Patent number
7,498,667
Issue date
Mar 3, 2009
Stats Chippac Ltd.
Jong-Woo Ha
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked integrated circuit package-in-package system
Patent number
7,368,319
Issue date
May 6, 2008
Stats Chippac Ltd.
Jong-Woo Ha
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR PACKAGE WITH IMPROVED SPACE UTILIZATION AND METHOD FO...
Publication number
20240290671
Publication date
Aug 29, 2024
STATS ChipPAC Pte Ltd.
Gwang KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Double-Sided Partial Molded SiP Module
Publication number
20240153783
Publication date
May 9, 2024
STATS ChipPAC Pte Ltd.
HunTeak Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming Semiconductor Package wi...
Publication number
20240128201
Publication date
Apr 18, 2024
STATS ChipPAC Pte Ltd.
HunTeak Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming Semiconductor Package wi...
Publication number
20230081706
Publication date
Mar 16, 2023
STATS ChipPAC Pte Ltd.
HunTeak Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Double-Sided Partial Molded SIP Module
Publication number
20230074430
Publication date
Mar 9, 2023
STATS ChipPAC Pte Ltd.
HunTeak Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming RF FEM with LC Filter an...
Publication number
20130069197
Publication date
Mar 21, 2013
STATS ChipPAC, Ltd.
HyunTai Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming RF FEM and RF Transceive...
Publication number
20120319302
Publication date
Dec 20, 2012
STATS ChipPAC, Ltd.
YongTaek Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semicinductor Device with Cross-Talk Isolation Using M-CAP and Meth...
Publication number
20120299149
Publication date
Nov 29, 2012
STATS ChipPAC, Ltd.
YongTaek Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming Shielding Layer Around B...
Publication number
20120187531
Publication date
Jul 26, 2012
STATS ChipPAC, Ltd.
YongTaek Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming Shielding Layer Around B...
Publication number
20110304011
Publication date
Dec 15, 2011
STATS ChipPAC, Ltd.
YongTaek Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming RF FEM With LC Filter an...
Publication number
20110304012
Publication date
Dec 15, 2011
STATS ChipPAC, Ltd.
Hyun Tai Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THIN PACKAGE SYSTEM WITH EXTERNAL TERMINALS AND METHOD OF MANUFACTU...
Publication number
20110215456
Publication date
Sep 8, 2011
Youngcheol Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device With Cross-Talk Isolation Using M-CAP and Meth...
Publication number
20090236734
Publication date
Sep 24, 2009
STATS ChipPAC, Ltd.
YongTaek Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STACKED INTEGRATED CIRCUIT PACKAGE-IN-PACKAGE SYSTEM
Publication number
20070241453
Publication date
Oct 18, 2007
STATS ChipPAC Ltd.
Jong-Woo Ha
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STACKED INTEGRATED CIRCUIT PACKAGE-IN-PACKAGE SYSTEM
Publication number
20070241442
Publication date
Oct 18, 2007
STATS ChipPAC Ltd.
Jong-Woo Ha
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STACKED INTEGRATED CIRCUIT PACKAGE-IN-PACKAGE SYSTEM
Publication number
20070218689
Publication date
Sep 20, 2007
STATS ChipPAC Ltd.
Jong-Woo Ha
H01 - BASIC ELECTRIC ELEMENTS