GWANG-SOO KIM

Person

Portland, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Recoiled metal thin film for 3D inductor with tunable core
- Patent number 11,444,148
- Issue date Sep 13, 2022
- Intel Corporation
- Gwang-Soo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fuse array for integrated circuit
- Patent number 10,811,354
- Issue date Oct 20, 2020
- Intel Corporation
- Gwang-Soo Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FIDUCIAL MARKS FOR VERIFYING ALIGNMENT ACCURACY OF BONDED INTEGRATE...
- Publication number 20240006332
- Publication date Jan 4, 2024
- Intel Corporation
- Dimitrios Antartis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVE CIRCUIT ON A BACK-END-OF-LINE OF A PACKAGE
- Publication number 20240006347
- Publication date Jan 4, 2024
- Intel Corporation
- Qiang YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTORS FOR HYBRID BONDING INTERCONNECT ARCHITECTURES
- Publication number 20230299123
- Publication date Sep 21, 2023
- Intel Corporation
- Qiang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERLAYER DIELECTRIC STACK OPTIMIZATION FOR WAFER BOW REDUCTION
- Publication number 20230207486
- Publication date Jun 29, 2023
- Intel Corporation
- Gwang-Soo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC DIE STACKING WITH MIXED HYBRID AND SOLDER BONDING
- Publication number 20230207525
- Publication date Jun 29, 2023
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOISTURE SEAL COATING OF HYBRID BONDED STACKED DIE PACKAGE ASSEMBLY
- Publication number 20230197637
- Publication date Jun 22, 2023
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECOILED METAL THIN FILM FOR 3D INDUCTOR WITH TUNABLE CORE
- Publication number 20200194540
- Publication date Jun 18, 2020
- Gwang-Soo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FUSE ARRAY FOR INTEGRATED CIRCUIT
- Publication number 20190326216
- Publication date Oct 24, 2019
- Intel Corporation
- GWANG-SOO KIM
- H01 - BASIC ELECTRIC ELEMENTS

GWANG-SOO KIM

Person

Patents Grantslast 30 patents

Recoiled metal thin film for 3D inductor with tunable core

Fuse array for integrated circuit

Patents Applicationslast 30 patents

FIDUCIAL MARKS FOR VERIFYING ALIGNMENT ACCURACY OF BONDED INTEGRATE...

PASSIVE CIRCUIT ON A BACK-END-OF-LINE OF A PACKAGE

INDUCTORS FOR HYBRID BONDING INTERCONNECT ARCHITECTURES

INTERLAYER DIELECTRIC STACK OPTIMIZATION FOR WAFER BOW REDUCTION

IC DIE STACKING WITH MIXED HYBRID AND SOLDER BONDING

MOISTURE SEAL COATING OF HYBRID BONDED STACKED DIE PACKAGE ASSEMBLY

RECOILED METAL THIN FILM FOR 3D INDUCTOR WITH TUNABLE CORE

FUSE ARRAY FOR INTEGRATED CIRCUIT