Gwanghee Jo

Follow

Person

Hwaseong-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Wafer to wafer bonding apparatuses
- Patent number 11,443,965
- Issue date Sep 13, 2022
- Samsung Electronics Co., Ltd.
- Kyeongbin Lim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCT...
- Publication number 20240242981
- Publication date Jul 18, 2024
- Samsung Electronics Co., Ltd.
- Sehoon JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE BONDING APPARATUS
- Publication number 20240153906
- Publication date May 9, 2024
- Samsung Electronics Co., Ltd.
- Byeongtak PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SUBSTRATE ALIGNMENT DEVICE AND A SEMICONDUCTOR SUBSTR...
- Publication number 20220068688
- Publication date Mar 3, 2022
- Samsung Electronics Co., Ltd.
- Gwanghee JO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER TO WAFER BONDING METHODS AND WAFER TO WAFER BONDING APPARATUSES
- Publication number 20210005475
- Publication date Jan 7, 2021
- Samsung Electronics Co., Ltd.
- Kyeongbin LIM
- H01 - BASIC ELECTRIC ELEMENTS